摘要
超声倒装是近年来芯片封装领域中快速发展的一种倒装技术,具有连接强度高、接触电阻低、可靠性高、低温下短时完成和成本低的优势,特别适合较少凸点的RFID芯片封装。在镀Ni/Au铜基板上进行了RFID芯片超声倒装焊接实验,金凸点与镀Ni/Au铜基板之间实现了冶金结合,获得了良好的力学与电气性能,满足射频要求。
Ultrasonic flip chip packaging is a rapidly developing technology for die bonding in the recent years.It has the advantages of high bonding strength,low contact resistance,high reliability,low cost,low-temperature and short-time process,and is especially suitable to the RFID die packaging with small bumps.The RFID die is bonded on the nickel-gold-plated copper substrate by the ultrasonic flip-chip welding.The metallurgical bonding is achieved between the gold bumps and the nickel-gold substrate,which offer a good mechanical and electrical performance,and satisfy the requirement of the radio frequency.
出处
《电子工艺技术》
2011年第6期326-329,共4页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:60876070
60976076)
关键词
射频识别
芯片封装
超声倒装
冶金结合
Radio Frequency Identification
Die bonding
Ultrasonic flip-chip
Metallurgical bonding
作者简介
张加波（1986-），男，硕士，主要从事电子封装可靠性与电子封装材料的研究。
