摘要
将自蔓延方法制备的氮化铝粉体加入到有机硅树脂中,制备出导热性能优良的印制电路组件用高导热有机硅灌封材料,并详细介绍了该灌封料的灌封工艺过程。
High thermal conductivity silicone polymers encapsulant used for printed circuit board assembly has been investigated.The AlN powders prepared by self-propagating high-temperature synthesis are mixed into silicone polymer,which leads the encapsulant possessing a high thermal conductivity.In addition,the encapsulating technology of this encapsulant is described in details.
出处
《印制电路信息》
2011年第5期58-60,共3页
Printed Circuit Information
关键词
氮化铝粉体
有机硅树脂
灌封料
工艺
AlN powders
silicone polymers
encapsulant
encapsulating technology
