摘要
采用正交法研究了Pd-Cu合金膜的化学镀制备过程,考察了镀液组成和制备条件对镀膜速率的影响.在化学镀膜过程中,CuCl2浓度对镀膜沉积速度的影响最大,最优Cu镀液组成和制备条件为CuCl20.04 mol/L,KNaC4H4O60.05 mol/L,HCHO 15.0 mL/L,温度30℃.根据Pd、Cu的沉积速率,控制化学镀Cu的时间可制备出一系列精确Pd/Cu质量比的致密Pd-Cu合金膜.
The electroless plating process of Pd-Cu alloy membranes and the influences of plating bath composition and conditions on the deposition of membrane were investigated.It was found that the concentration of CuCl2 was the most important factor on the Cu deposited rates.The optimized composition and conditions were CuCl2 0.04 mol/L,KNaC4H4O6 0.05 mol/L,HCHO 15.0 mL/L,temperature as 30 ℃.According to the deposition rates of Pd and Cu,it was easy to prepare dense Pd-Cu alloy membranes with different Pd/Cu ratios by controlling the Cu deposited time.
出处
《江西师范大学学报（自然科学版）》
CAS
北大核心
2010年第5期516-519,共4页
Journal of Jiangxi Normal University(Natural Science Edition)
基金
国家“863”计划项目(2009AA05Z103)
江苏省高校自然科学研究重大项目(09KJA530003)
江西师范大学青年成长基金资助项目
关键词
钯铜合金膜
化学镀
正交法
Pd-Cu alloy membrane
electroless plating
orthogonal design
作者简介
作者简介：张小亮（1980-），男，江西峡江人，副教授，博士，主要从事无机膜与膜催化方面的研究．
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