摘要
从化学镀理论出发,建立了Pd-Ag共沉积行为的数学模型,通过验证表明该模型参数计算值与实验值的误差较小,对化学镀共沉积钯银有一定的指导意义。分别考察了在一定的镀液金属总浓度([M]O)、还原剂肼的浓度([N2H4])和pH的条件下,模型参数温度(t)、镀液中Pd/Ag摩尔比(α)和ED-TA浓度(ρ)对金属沉积速度、镀层银含量和两金属还原电位差的影响。实验结果表明,当[M]0、t、ρ和α分别为5×10-3mol/L、40℃、40 g/L和4∶1时,采用化学镀共沉积法可制得陶瓷负载型76.9%Pd-23.1%Ag无机复合膜,且镀层厚度为8.5μm。在350℃和0.3 MPa下,氢气和氮气通过膜的渗透通量分别为7.9×10-3m3/(m2.s)和2.1×10-6m3/(m2.s)。
A mathematic model describing the co-deposition behavior of Pd-Ag was established based on the theory of electroless plating. The calculated values of the model＇s parameters were proved to be similar to experimental values, which indicates that the model has certain guiding significance to the research on Pd-Ag co-deposition. The influences of model parameters, including temperature （ t）, the molar ratio of Pd/Ag in bath （α）, the content of EDTA in bath （ρ）on deposition rate, the content of Ag in deposit and the reduction potential difference of Pd and Ag were investigated at certain total concentration of metal ions in bath （ [ M ] 0 ） , the content of reducer hydrazine and pH value. The experimental results show that when [ M ] 0, t, ρ and α are 5 × 10 ^-3 mot/L,40 ℃ ,40 g/L and 4：1 respectively, an inorganic composite thin film of 76. 9% Pd-23.1% Ag alloy with thickness of 8.5 μm was prepared on ceramic tube. The permeation fluxes of hydrogen and nitrogen through the composite membrane were 7.9 ×10^-3m^3/（m^2·s） and 2. 1 ×10^-6m^3/（m^2·ss ） respectively.
出处
《电镀与涂饰》
CAS
CSCD
2006年第5期4-6,共3页
Electroplating & Finishing
关键词
化学镀
共沉积
Pd—Ag
数学模型
陶瓷
eleetroless plating
co-deposition
Pd-Ag
mathematic model
ceramic
作者简介
蒋柏泉（1949-），男，江苏无锡人，鞍授，研究方向为传质与分离工程和无机膜制备与分离。作者联系方式：（Email）jbq_win@sohu．com，（Tel）0791—6905142。
