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溶液法制备氧化锌半导体薄膜及其顶栅极晶体管器件 被引量:1

Solution-Processed Zinc Oxide Thin Films and Top-Gate Thin Film Transistors
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摘要 采用旋涂法用浓度分别为0.05,0.10和0.25mol·L-1的氧化锌前躯体溶液制备了氧化锌薄膜,并且制备了基于氧化锌多层膜的顶栅极晶体管器件,其中以利用光刻工艺刻蚀的氧化铟锡为源漏电极。通过原子力显微镜(AFM)和X-射线衍射(XRD)分别表征了薄膜的形貌以及结晶情况,并且讨论了前躯体的浓度顺序对氧化锌多层膜的影响。按照浓度从大到小的顺序依次旋涂前躯体溶液制备的氧化锌薄膜表现出了较高的载流子迁移率(7.1×10-3cm2·V-1·s-1),而按照浓度从小到大的顺序依次旋涂前躯体溶液制备的氧化锌薄膜的载流子迁移率为5.2×10-3cm2·V-1·s-1。文中通过对两种多层薄膜的形貌和结晶性能的分析表明影响顶栅极薄膜晶体管性能的主要因素是薄膜的粗糙度。平整的薄膜有利于形成较好的半导体层/绝缘层接触界面,从而有利于提高器件的载流子迁移率。 ZnO thin films were prepared by spin-coating the precursor solution with different concentrations. The morphologies and crystallinity of the ZnO films were characterized by Atomic Force Microscopy (AFM) and X-ray Diffraction (XRD). Muhilayer ZnO films were employed as active layers to prepare thin film transistors (TFTs), and patterned indium tin oxide (ITO) was used as source and drain electrodes. The device based on the three-layer ZnO films, prepared with the precursor concentration order of 0.25, 0.10 and 0.05 mol'L-1, showed higher mobility of 7.1×10^-3cm^2·V^-1·S·^-1 than the device with the precursor concentration order of 0.05, 0.10 and 0.25 mol·L^-1(5.2×10^-3cm·V^-1·S·^-1). The difference of the performance of TFTs based on these two kinds of films is attributed to the roughness of the multilayer ZnO thin films. Smooth film is useful for forming excellent semiconductor/insulator interface, resulting in high mobility.
出处 《无机化学学报》 SCIE CAS CSCD 北大核心 2009年第12期2071-2076,共6页 Chinese Journal of Inorganic Chemistry
基金 国家自然科学基金(No.60877026) 国家重点基础研究与发展规划(No.2006CB806203和2009CB930602)项目资助
关键词 溶液处理 氧化锌 顶栅极晶体管 solution-process ZnO top-gate thin film transistor
作者简介 王小燕,女,27岁,博士研究生;研究方向:溶液法制备无机半导体薄膜。 通讯联系人:邱勇,E-mail:qiuy@tsinghua.edu.cn;Tel:010-62771964
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同被引文献23

  • 1Bae C D,Kim D J,Moon S. Aging dynamics of solution-processed amorphous oxide semiconductor field effect transistors[J].Appl Mater Inter,2010,(03):626-632.
  • 2Kim Y H,Han M K,Han J I. Effect of metallic composition on electrical properties of solution-processed indiumgallium-zinc-oxide thin-film transistors[J].IEEE Transactions on Electron Devices,2010,(05):1009-1014.
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  • 4Chen T C,Chang T C,Hsieh T Y. Investigating the degradation behavior caused by charge trapping effect under DC and AC gate-bias stress for InGaZnO thin film transistor[J].Applied Physics Letters,2011,(02):022104-0221-3.
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  • 6Park S K,Kim Y H,Han J I. All solution-processed high-resolution bottom-contact transparent metal-oxide thin film transistors[J].Journal of Physics D:Applied Physics,2009.125102-1251-6.
  • 7Yang Y H,Yang S S,Kao C Y. Chemical and electrical properties of low-temperature solution-processed In-Ga-ZnO thin-film transistors[J].IEEE Electron Device Letters,2010,(04):329-331.
  • 8Kim C E,Cho E N,Moon P. Density-of-states modeling of solution-processed InGaZnO thin-film transistors[J].IEEE Electron Device Letters,2010,(10):1131-1133.
  • 9Kim G H,Ahn B D,Shin H S. Effect of indium composition ratio on solution-processed nanocrystalline InGaZnO thin film transistors[J].Applied Physics Letters,2009,(23):233501-2331-3.
  • 10Kim D,Koo C Y,Song K K. Compositional influence on sol-gel-derived amorphous oxide semiconductor thin film transistors[J].Applied Physics Letters,2009,(10):103501-1031-3.

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