摘要
第一次,只有几纳米厚的薄层沉积在印制电路板的铜焊盘pad上,并且可以有效地防止氧化并保证其焊锡性。纳米层的厚度仅仅只有50nm,包含有机金属(导电聚合物)和少量的银。大于90%(体积)的有机金属是沉积层的主要组成部分,约存在相当于4nm厚的银。这个有机金属——银络合物的表面涂覆比任何已有的表面涂覆都要优越。
For the first time, an only few nanometre thin layer has been deposited on copper pads of printed circuit boards which efficiently protects against oxidation and preserves its solderability. The nano layer has a thickness of only nominally 50 nm, containing the Organic Metal （conductive polymer） and a small amount of silver. With 〉 90% Coy volume）, the Organic Metal is the major component of the deposited layer, Ag is present equivalent to a 4nm thickness. This Organic Metal C Ag complex final finish outperforms any established surface finishes.
出处
《印制电路信息》
2007年第12期48-54,共7页
Printed Circuit Information
