摘要
The processes for electroplating of copper in a pyrophosphate bath were elucidated in details with respect to the pretreatment, pre-plating, bath formulation, plating conditions and principle, preparation of plating bath, bath composition and action of each ingredient, effect of operating conditions on the performance of the copper coating, maitainance of the plating bath, effect of the impurities and the methods to remove the impurities, effect of maladjustment of bath composition and correction, effect of phosphate radicle on the bath stability and coating performance, generation and removal of copper powders, and common faults and methods for troubleshooting. At the same time, the methods to analyze phosphate and pyrophosphate radicles in the plating bath and that to remove unqualified copper coating were briefed as well.
The processes for electroplating of copper in a pyrophosphate bath were elucidated in details with respect to the pretreatment, pre-plating, bath formulation, plating conditions and principle, preparation of plating bath, bath composition and action of each ingredient, effect of operating conditions on the performance of the copper coating, maitainance of the plating bath, effect of the impurities and the methods to remove the impurities, effect of maladjustment of bath composition and correction, effect of phosphate radicle on the bath stability and coating performance, generation and removal of copper powders, and common faults and methods for troubleshooting. At the same time, the methods to analyze phosphate and pyrophosphate radicles in the plating bath and that to remove unqualified copper coating were briefed as well.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第11期53-58,共6页
Materials Protection
关键词
焦磷酸盐镀铜
预镀
工艺
故障排除
pyrophosphate copper electroplating
pre-plating
process
troubleshooting
