摘要
主要探讨了影响电镀铜用磷铜阳极质量的因素,包括原材料、铜晶粒结构、磷含量及阳极表面的清洁。分别比较了某公司磷铜阳极标准与国内一般磷铜阳极标准、粗大铜晶粒结构与精细铜晶粒结构图,并将该公司揉制磷铜球黑膜形成及表面溶解状况与低质量轧制磷铜球进行了比较。介绍了优质铜阳极的特点:低金属杂质;铜晶粒精细、规整;磷铜阳极的磷含量为0．04％-0．065％且均匀分布等。
The factors affecting the quality of phosphorized copper anode used for acidic copper electroplating were discussed, including materials, grain structure, phosphorous content and cleaning of anode surface. The standard for the phosphorized copper anode of one company was compared with that for common phosphorized copper anode in China, and the structure photo of coarse grain copper was compared with that of refined copper grain. The formation of black film and surface dissolving state of the kneaded phosphorized copper ball of the company were compared with those of low- quality rolled phosphorized copper ball. The characters of high quality copper anode were as follows： low content of metal impurities, fine and regular copper grain, 0.04%-0. 065% of phosphorous in phosphorized copper anode with even distribution, etc.
出处
《电镀与涂饰》
CAS
CSCD
2006年第9期35-38,共4页
Electroplating & Finishing
关键词
酸性电镀铜
磷铜阳极
影响因素
晶粒结构
磷含量
acidic copper electroplating
phosphorized copper anode
affecting factors
grain structure
phosphorous content
作者简介
张立伦，男，苏州大学化学工程硕士，工程师，有多年从事金属电化学及PCB电镀工艺的研究、管理经验。作者联系方式：（Email）allenzhang@univertical．cn，（Tel）0512-66610088-8304。
