摘要
为比较真实地模拟可动微机电器件侧面间的摩擦磨损状况,进而研究MEMS器件的摩擦磨损规律,设计和研制了一种基于单晶硅材料的微摩擦试验模块,利用微机械体硅工艺及键合技术,将摩擦磨损测试单元、加载单元以及微力传感元件集成在单一的芯片上。最后,在大气环境下借助数字光学显微镜和图像处理技术对该试验模块的静、动态摩擦因数及磨损状况进行了测试。试验结果表明:随着正压力的增加,该摩擦副的摩擦因数相应减小,在较长时间的摩擦过程中磨粒表面出现了比较严重的氧化现象。
An on-chip micro-tribotester was developed to simulate the tribology behaviors on sidewalls of single crystal silicon MEMS devices. In this system, the loading structure, frictional pair and force sensors are all integrated on a single chip by the bulk silicon process and bonding technology. Tribology testing was carried out on the micro-tribotester under a digital microscope at ambient condition. It is found that friction coefficient decreases with the increase of normal force. In addition, severe oxidation is detected out on the wear debris surface after a long time high frequent reciprocating wear testing.
出处
《润滑与密封》
CAS
CSCD
北大核心
2006年第7期12-14,17,共4页
Lubrication Engineering
基金
国家杰出青年科学基金项目(50525515)
"973"计划课题(2003CB716205)
关键词
微机电器件
摩擦磨损
体硅工艺
键合技术
摩擦因数
MEMS devices
friction and wear
bulk silicon process
bonding technology
friction coefficient
作者简介
孟永钢（1961-），研究员，博士生导师．E-mail：mengyg@mail．tsinghua.edu．cn．
