摘要
高强高导铜合金材料是集成电路和电子元器件发展的基础。铜合金材料具有优良的导电导热性能,而且价格相对低廉,在集成电路封装领域应用广泛。在不过分降低其导电导热性能的前提下,可采取多种强化方式来提高新型合金材料的综合性能,以满足集成电路封装技术发展的需要。本文概述了引线框架用高强高导铜合金材料的种类、研究现状及应用前景。
The copper alloy with high-strength and high-conductivity is base of IC and electronic element development.The copper alloy has not only excellent electrical and thermal conductivity,but also it is low cost.So it is widely used in integrated circuits.It is a common subject that improving properties of new alloy in many strengthening meth-ods without decreasing electrical and thermal conductivity in order to meet integrated cir-cuit industry's need.
出处
《电工材料》
CAS
2005年第2期33-37,43,共6页
Electrical Engineering Materials
关键词
高强高导
铜合金
弥散强化
沉淀强化
high-strength and high-conductivity
copper alloy
dispersion strengthening
pre-cipitation strengthening
