摘要
分析研究了轧制温度和单道次变形率对Kovar/Cu/Kovar层状复合材料制备的影响.结果表明,轧制温度为800℃,单道次变形率为50%时,Kovar/Cu/Kovar电子封装材料的界面结合强度较好,电阻率、抗拉强度等性能均达到要求。
Study is made of the effect of rolling temperature and single-pass deformation rate on Kovar/Cu/Kovar laminates . The results show that Kovar/Cu/Kovar electronic packaging material has good interfacial combination strength with acceptable resistivity and high tensile strength at 800℃ and 50% single-pass deformation rate.
出处
《稀有金属与硬质合金》
CAS
CSCD
2004年第2期7-10,共4页
Rare Metals and Cemented Carbides
基金
国家高新工程重点项目
