摘要
采用无压渗透法制备了SiCp/356Al复合材料,用SEM和XRD对复合材料组织形貌和物相进行了研究,测定了复合材料在50～400℃温度区间的热膨胀系数,分析了复合材料热膨胀性能的影响因素。结果表明SiCp/356Al复合材料中SiC颗粒分布均匀,无明显新相形成,复合材料的热膨胀系数比基体合金的热膨胀系数显著降低,复合材料热应力引起热膨胀性能的变化随温度的不同而不同。
SiCp/356Al composite was prepared by pressureless infiltration. The microstructure and phases of SiCp/356Al composite was investigated by means of scanning electron microscope (SEM) and X ray diffraction (XRD). The coefficient of thermal expansion (CTE) of SiCp/356Al composite was measured in the temperature interval of 50°C-400°C. The influence factors on thermal expansion performance were analyzed. The results show that the distribution of particulates in SiCp/356Al composite is homogeneous. No new phase appears in the composite. The CTE of the composite decreases apparently by comparison with the CTE of its matrix alloy. The influence of thermal stress on the CTE of the composite depends on temperature range.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2004年第4期507-508,512,共3页
Journal of Functional Materials
基金
国家自然科学基金资助项目(50275074)
江西省自然科学基金资助项目(0350038)
关键词
电子封装
无压渗透
SiCp/356Al复合材料
热膨胀系数
Aluminum alloys
Electronics packaging
Infiltration
Metallographic microstructure
Particles (particulate matter)
Phase composition
Scanning electron microscopy
Silicon carbide
Thermal expansion
Thermal stress
X ray diffraction analysis
