摘要
文章研究了PCB钻孔用不同复合垫板间的钻孔性能差异,介绍了密胺板、快压板、复合白板、UV垫板和高密度木纤板的结构和工艺差异.通过对钻孔时的钻屑形态、钻削轴向力、钻削温度、钻针磨损与缠丝、孔口形貌、孔内残屑和钻孔性能方面进行研究和分析,不同复合垫板间的钻孔性能有较大差异;研究表明密胺板的特性和钻孔性能最佳.
In this paper,the drilling performance difference between composite back—ups for PCB drilling is studied.The structure and process differences of melamine laminated board,fast press board,composite board,UV board and high density wood fiber board were introduced through the research and analysis on drilling performance,drilling axial force,drilling temperature,drill wear and wrapping,hole debris,shape of holes edge when drilling.The drilling performances of different composite back—up have big difference.The research also shows that the properties and drilling performance of melamine back—up are the best.
作者
杨迪
张伦强
刘飞
YANG Di;ZHANG Lun-qiang;LIU Fei
出处
《印制电路信息》
2017年第A02期62-71,共10页
Printed Circuit Information
关键词
钻孔
印制电路版
复合垫板
密胺板
Drilling
PCB
Composite Back-up
Melamine Laminated Back—up
作者简介
第一作者:杨迪,研发工程师,从事盖垫板新产品开发技术研究工作。
