摘要
随着消费型电子产品对便携性的要求越来越高以及智能穿戴设备的逐渐普及,印制电路板对小型化、轻薄化、高集成度以及安装灵活性有了更高的要求.因此挠性印制电路板制作技术得到了越来越多的重视和应用.文章主要研究了挠性印制电路板通孔电镀铜技术的均镀能力以及镀层可靠性.文章首先采用循环伏安法对不同种类的抑制剂进行测试,并筛选出电化学性能最优异的抑制剂用于挠性板通孔电镀.然后以板厚85 μm、通孔孔径200 μm的挠性板为例,先以硫酸铜、硫酸浓度为变量进行优化实验设计,再分别对光亮剂浓度、抑制剂浓度、电流密度、气流量、电镀时间进行单因素测试并选取合理变量范围进行优化实验设计.最后以最优配方进行电镀,测试铜镀层可靠性.实验结果表明:光亮剂浓度和电流密度对挠性板通孔电镀均镀能力有显著影响,最优配方的均镀能力达到200%以上,铜镀层热冲击测试循环10次,未发现品质问题,满足印制电路板品质要求.
With the increasing demand for portability of consumer electronics and the gradual popularization of wearable smart devices,the demand for miniaturization,lightening and thinning,high integration and flexibility installation of printed circuit boards iS growing.Therefore.the manufacturing technology of flexible printed circuit board(FPCB)has obtained more attention.In this study,the throwing power and reliability of through hole copper electroplating for flexible printed circuit board were investigated.Different candidates were evaluated by cyclic voltammetry,and the best among them was selected as an inhibitor of electrolyte.Then,concentration of copper sulfate and sulfuric acid were optimized by through hole electroplating whichwas carried on the test coupons ofthickness of 85μm and hole—diameters of 200μm.Further,single factor experiments were performed on concentration of accelerator,concentration of inhibitor,air flow rate and current density.The reliability of optimized copper deposit layer had been tested by thermal shock test as well.It revealed that the concentration of accelerator and current density had a significant effect on throwing power of the through—hole plating.The optimal formula had showed a throwing power over 200%,and none quality problems were observed after the 10 cycles thermal shock test,which indicated the copper layer was competent to the quality requirements of printed circuit board manufacture.
作者
熊艳平
程骄
梁坤
程东向
王翀
刘彬云
何为
陈世金
XIONG Yan-ping;CHENG Qiao;LIANG Kun;CHENG Dong-xiang;WANG Chong;LIU Bin-yun;HE Wei;CHEN Shi-jin
出处
《印制电路信息》
2017年第A02期255-262,共8页
Printed Circuit Information
基金
广东省引进创新科研团队计划(201301C0105324342)
广东省企业重点实验室建设项目(2016B030302005)
广东省产学研合作项目(2015B090901032).
关键词
挠性印制电路板
电镀通孔
抑制剂
优化实验
Flexible Printed Circuit Board(FPCB)
Through Hole Plating
Inhibitor
Optimization Experiment
作者简介
第一作者:熊艳平,电子科技大学硕士在读研究生,师从专家何为教授,主要研究方向PCB电镀铜以及铜表面改性技术。
