摘要
晶圆测试是芯片制造产业中十分重要的环节,是芯片良品率最主要的测试方法,探针台作为晶圆测试的主要设备,用来检测晶圆质量的好坏,在芯片制造过程中有着重要的作用。晶圆片尺寸的增大和晶圆密度的提高会导致探针台晶圆测试时间的增加,需要运行速度更快的机械装置和更加精确的机器视觉识别系统来执行测试工作。高速运行的机械装置给本就复杂的晶圆测试体系中额外增加了振源,以及其他设备引起的环境振动,使得晶圆测试不稳定性增加。本文采用有限单元仿真软件对探针台结构进行数学建模,通过施加探针台制造和运行过程中典型的动载荷对探针台中的典型部件进行动力学分析,得到了探针台各部件结构的固有频率和模态振型,进而研究影响探针台振动的主要物理因素,通过分析这些物理因素来优化探针台各部件的质量分布、刚度设计和阻尼设计。本文的研究可望为提升晶圆测试时受振动激励下的控制精度和稳定性提供数据支撑,为研发高速度、高精度、高自动化、高可靠性的全自动晶圆探针测试台提供理论支持和方法借鉴。
Wafer testing is a very important process in the chip manufacturing industry and the main test method of chip yield.As the main equipment of wafer testing,the probe table is used to detect the quality of wafer,which plays an important role in the process of chip manufacturing.The increase of wafer size and wafer density leads to the increase of wafer test time of probe table,which requires faster mechanical devices and more accurate machine vision recognition system to perform the test work.The high-speed mechanical device adds an additional vibration source to the already complex wafer testing system,as well as the environmental vibration caused by other equipment,which increases the instability of wafer testing.In this paper,the finite element simulation software is used to mathematically model the structure of the probe table.By applying the typical dynamic load in the process of manufacturing and operation of the probe table,the dynamic analysis of the typical components in the probe table is carried out,and the natural frequencies and modal shapes of each component structure of the probe table are obtained.Then,the main physical factors affecting the vibration of the probe table are studied.By analyzing these physical factors,the mass distribution of each component of the probe table is optimized stiffness design and damping design.The research of this paper is expected to provide data support for improving the control accuracy and stability under vibration excitation during wafer testing,and provides theoretical support and method reference for the development of automatic wafer probe test-bed with high speed,high precision,high automation and high reliability.
作者
韩笑
鲍军其
张新
刘治震
周传平
HAN Xiao;BAO Junqi;ZHANG Xin;LIU Zhizhen;ZHOU Chuanping(Hangzhou Changchuan Technology Co.,Ltd.,Hangzhou 310062,China;School of Mechatronics Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China)
出处
《微纳电子与智能制造》
2022年第1期88-93,共6页
Micro/nano Electronics and Intelligent Manufacturing
基金
国家自然科学基金项目(51875146)资助
关键词
探针台
晶圆测试
有限单元法
结构优化
prober
wafer test
finite element method
structural optimization
作者简介
韩笑,本科,主要研究方向为半导体测试。E-mail:hanxiao@hzcctech.net;通信作者:鲍军其,硕士,主要研究方向为半导体测试。E-mail:baojunqi@hzcctech.net
