摘要
集成电路逻辑技术和存储技术在后摩尔时代已无法单纯依靠平面尺寸微缩来实现更新迭代,立体化(或三维化)已成为重要的发展方向。文章主要从逻辑、存储、三维集成3方面探讨了后摩尔时代产业界关注较多且与当前集成电路产业技术和生态兼容性较高的技术发展趋势,分析了各类技术的优点及挑战,并尝试给出中国研究发展的建议。逻辑技术以器件发展为主线,对从目前量产的主流鳍式场效应晶体管(FinFET)到即将进入量产的围栅纳米器件进行探讨,继而展望了堆叠叉片(Forksheet)晶体管和互补场效应晶体管(CFET)两种器件;存储技术以不同类型的存储器件为主线,覆盖了量产中及即将进入量产的6类存储器;三维集成讨论了三维堆叠、芯粒(Chiplet)、大芯片3种目前较受关注的技术。
Logic and memory technologies of integrated circuits(ICs)cannot be updated simply by plane scaling in the post-Moore era,and three dimensions(or 3D)have become a promising development direction.This paper discussed the development of technologies that have attracted wide attention from industries in the post-Moore era and are highly compatible with the existing IC industrial technologies and ecology in terms of logic,memory,and 3D integration.Furthermore,the paper analyzed the advantages and challenges of various technologies and tried to give suggestions on China’s research and development in this regard.In addition,in terms of logic technology,the paper started from the device development to expound on the current mainstream FinFET in mass production and gate-all-around nanodevices to be mass-produced and then introduced Forksheet and CFET devices.In terms of memory technology,the paper analyzed several memory devices,which include six different memorizers that are or are to be mass-produced.Finally,in terms of 3D integration,the paper described three popular technologies including 3D stacking,Chiplet,and large chips.
作者
卜伟海
夏志良
赵治国
刘芸
周亦康
BUWeihai;XIA Zhiliang;ZHAO Zhiguo;LIU Yun;ZHOU Yikang(Semiconductor Technology Innovation Center(Beijing)Corp.,Beijing 100176,China;Yangtze Memory Technologies Co.,Ltd.,Wuhan 430000,China)
出处
《前瞻科技》
2022年第3期20-41,共22页
Science and Technology Foresight
关键词
后摩尔时代
集成电路
先进逻辑
先进存储
三维集成
post-Moore era
integrated circuit
advanced logic
advanced memory
3D integration
作者简介
通信作者:卜伟海,教授级高级工程师。现任北方集成电路技术创新中心副总经理、技术开发与合作负责人。主要研究方向为先进逻辑器件与工艺、嵌入式新型存储技术等。曾作为国内领先集成电路企业的先导技术研发团队骨干和负责人完成多个节点工艺技术预研,主持和参与国家“863”计划、国家重点研发计划、国家科技重大专项02专项等多个重大项目。入选北京市优秀人才培养资助计划、北京经济技术开发区“亦麒麟”杰出人才。合作撰写专著2部,发表论文20余篇,获授权发明专利52项。电子信箱:weihai_bu@sticbj.com。
