摘要
LED半导体照明以节能、环保及光亮度更高,将逐渐替代其它普通节能灯,成为未来照明的发展趋势。文章通过第三代照明半导体氧化铝陶瓷基PCB的激光打孔技术、氧化铝陶瓷基与FR4混压技术、流胶及对位精度控制技术、氧化铝陶瓷基与FR4混压翘曲控制技术、板裂控制技术等关键技术研究,找到适合第三代照明半导体氧化铝陶瓷基PCB的制作方法,解决了氧化铝陶瓷制作过程中崩孔、板裂、翘曲等问题,完成了第三代照明半导体氧化铝陶瓷基PCB制作。
LED semiconductor lighting with energy saving,environmental protection and higher brightness,will gradually replace other ordinary energy-saving lamps,become the future lighting development trend.This paper made research by applying the third generation of semiconductor lighting technology,laser drilling alumina ceramic based PCB,alumina ceramic based and FR4 mixed compression technology,control technology of plastic flow and registration precision,alumina ceramic based and FR4 mixed compression buckling control technology.By key technologies,such as crack control technology research,it found the third generation of semiconductor lighting alumina ceramic based PCB manufacturing method.The problems such as hole breakage,crack and warping in the process of alumina ceramic production were solved,and the third generation illumination semiconductor alumina ceramic PCB was completed.
作者
黄克强
张长明
黄建国
凌小康
徐缓
Huang Keqiang;Zhang Changming;Huang Jianguo;Ling Xiaokang;Xu Huang
出处
《印制电路信息》
2022年第S01期185-191,共7页
Printed Circuit Information
关键词
氧化铝陶瓷
混压
流胶
激光打孔
板翘
Alumina Ceramic–Based
Mixed Pressure
Resin Flow
Laser Drilling
Warping
作者简介
第一作者:黄克强,博敏电子股份有限公司软硬板销售部高级总监、高级工程师。
