为了解决高精度组合导航系统的体积和重量较大的问题,基于多层陶瓷基板高密度布线和三维立体组装等系统级封装(System In Package,SiP)工艺技术,提出了一种全新的三维立体微系统封装结构。采用低温共烧陶瓷(Low Temperature Cofired Cer...为了解决高精度组合导航系统的体积和重量较大的问题,基于多层陶瓷基板高密度布线和三维立体组装等系统级封装(System In Package,SiP)工艺技术,提出了一种全新的三维立体微系统封装结构。采用低温共烧陶瓷(Low Temperature Cofired Ceramic,LTCC)基板高密度布线及贴装、基板堆叠、高正交度立体组装等SiP工艺,将三轴加速度计、三轴陀螺仪、卫星导航、地磁计和气压高度计等集成在一个封装单元中,研制出外形尺寸仅3.1 cm×2.9 cm×0.96cm、重量仅18g的组合导航微系统产品,拓展了应用领域。通过数据融合算法,可以有效提升导航精度和可靠性,具有广阔的应用前景。展开更多
随着装备信息化、轻量化程度不断提高,导航制导控制(Navigation Guidance and Control,GNC)系统设计日趋复杂,系统小型化、轻量化设计需求愈发迫切。系统级封装(System in Package,SiP)作为一种高密度集成封装手段,可以将多种功能芯片...随着装备信息化、轻量化程度不断提高,导航制导控制(Navigation Guidance and Control,GNC)系统设计日趋复杂,系统小型化、轻量化设计需求愈发迫切。系统级封装(System in Package,SiP)作为一种高密度集成封装手段,可以将多种功能芯片封装进更小的腔体内,实现系统高集成化、小型化。针对GNC系统小型化需求,基于SiP技术设计了一种GNC信息处理微系统电路,采用DSP(数字信号处理器)+FPGA(现场可编程门阵列)架构,集成接口芯片、存储芯片,采用成熟的陶瓷基板微系统集成技术研制,并进行了多物理场仿真。测试结果表明:电路功能正常,能够满足设计要求。对比原型验证板,该电路体积仅为45 mm×45 mm×11 mm,重量约60 g,采用该电路代替板级系统,可有效提高产品集成度,实现控制系统小型化的需求。展开更多
In this paper, an approach to the design of shielded radio-frequency （RF） phased-array coils for magnetic resonance imaging （MRI） is proposed. The target field method is used to find current densities distributed ...In this paper, an approach to the design of shielded radio-frequency （RF） phased-array coils for magnetic resonance imaging （MRI） is proposed. The target field method is used to find current densities distributed on primary and shield coils. The stream function technique is used to discretize current densities and to obtain the winding patterns of the coils. The corresponding highly ill-conditioned integral equation is solved by the Tikhonov regularization with a penalty function related to the minimum curvature. To balance the simplicity and smoothness with the homogeneity of the magnetic field of the coll＇s winding pattern, the selection of a penalty factor is discussed in detail.展开更多
The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalit...The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalities(e.g.,high voltage,flexibility,stretchability,self-healing,electrochromism and photo/thermal response)to PMSCs is essential for building multifunctional PMSCs and their smart selfpowered integrated microsystems.In this review,we summarized the latest advances in PMSCs from various functional microdevices to their smart integrated microsystems.Primarily,the functionalities of PMSCs are characterized by three major factors to emphasize their electrochemical behavior and unique scope of application.These include but are not limited to high-voltage outputs(realized through asymmetric configuration,novel electrolyte and modular integration),mechanical resilience that includes various feats of flexibility or stretchability,and response to stimuli(self-healing,electrochromic,photo-responsive,or thermal-responsive properties).Furthermore,three representative integrated microsystems including energy harvester-PMSC,PMSC-energy consumption,and all-in-one selfpowered microsystems are elaborately overviewed to understand the emerging intelligent interaction models.Finally,the key perspectives,challenges and opportunities of PMSCs for powering smart microelectronics are proposed in brief.展开更多
JK Microsystems公司推出一种嵌入式功率控制器，把调整，监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上，从而简化了电源设计。该板给设计者提供一种包括电压调整，电源开／关时...JK Microsystems公司推出一种嵌入式功率控制器，把调整，监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上，从而简化了电源设计。该板给设计者提供一种包括电压调整，电源开／关时间表和电压监视的现成解决方案。从太阳能板或电池传来的电源电压能控制输出1A的电流。展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
文摘为了解决高精度组合导航系统的体积和重量较大的问题,基于多层陶瓷基板高密度布线和三维立体组装等系统级封装(System In Package,SiP)工艺技术,提出了一种全新的三维立体微系统封装结构。采用低温共烧陶瓷(Low Temperature Cofired Ceramic,LTCC)基板高密度布线及贴装、基板堆叠、高正交度立体组装等SiP工艺,将三轴加速度计、三轴陀螺仪、卫星导航、地磁计和气压高度计等集成在一个封装单元中,研制出外形尺寸仅3.1 cm×2.9 cm×0.96cm、重量仅18g的组合导航微系统产品,拓展了应用领域。通过数据融合算法,可以有效提升导航精度和可靠性,具有广阔的应用前景。
文摘随着装备信息化、轻量化程度不断提高,导航制导控制(Navigation Guidance and Control,GNC)系统设计日趋复杂,系统小型化、轻量化设计需求愈发迫切。系统级封装(System in Package,SiP)作为一种高密度集成封装手段,可以将多种功能芯片封装进更小的腔体内,实现系统高集成化、小型化。针对GNC系统小型化需求,基于SiP技术设计了一种GNC信息处理微系统电路,采用DSP(数字信号处理器)+FPGA(现场可编程门阵列)架构,集成接口芯片、存储芯片,采用成熟的陶瓷基板微系统集成技术研制,并进行了多物理场仿真。测试结果表明:电路功能正常,能够满足设计要求。对比原型验证板,该电路体积仅为45 mm×45 mm×11 mm,重量约60 g,采用该电路代替板级系统,可有效提高产品集成度,实现控制系统小型化的需求。
基金Project supported by the National Nature Science Foundation of China (Grant No. 30900332)Grant of General Administration of Quality Supervision Inspection and Quarantine of China (Grant No. 201210079)+1 种基金the Program for Science and Technology Department of Zhejiang Province, China (Grant Nos. 2010C14010 and 2010C33172)the Natural Science Foundation of Zhejiang Province, China (Grant No. Y2090966)
文摘In this paper, an approach to the design of shielded radio-frequency （RF） phased-array coils for magnetic resonance imaging （MRI） is proposed. The target field method is used to find current densities distributed on primary and shield coils. The stream function technique is used to discretize current densities and to obtain the winding patterns of the coils. The corresponding highly ill-conditioned integral equation is solved by the Tikhonov regularization with a penalty function related to the minimum curvature. To balance the simplicity and smoothness with the homogeneity of the magnetic field of the coll＇s winding pattern, the selection of a penalty factor is discussed in detail.
基金the National Natural Science Foundation of China,China (Grant Nos.22125903,51872283,22109040)the“Transformational Technologies for Clean Energy and Demonstration”Strategic Priority Research Program of the Chinese Academy of Sciences (Grant No.XDA21000000)+4 种基金the Dalian Innovation Support Plan for High Level Talents,China (2019RT09)DICP,China (DICP I202032)the Dalian National Laboratory For Clean Energy (DNL),CAS,DNL Cooperation Fund,CAS,China (DNL202016,DNL202019)the Top-Notch Talent Program of Henan Agricultural University,China (30500947)the Joint Fund of the Yulin University and the Dalian National Laboratory for Clean Energy,China (YLU-DNL Fund 2021002,YLU-DNL Fund 2021009)。
文摘The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalities(e.g.,high voltage,flexibility,stretchability,self-healing,electrochromism and photo/thermal response)to PMSCs is essential for building multifunctional PMSCs and their smart selfpowered integrated microsystems.In this review,we summarized the latest advances in PMSCs from various functional microdevices to their smart integrated microsystems.Primarily,the functionalities of PMSCs are characterized by three major factors to emphasize their electrochemical behavior and unique scope of application.These include but are not limited to high-voltage outputs(realized through asymmetric configuration,novel electrolyte and modular integration),mechanical resilience that includes various feats of flexibility or stretchability,and response to stimuli(self-healing,electrochromic,photo-responsive,or thermal-responsive properties).Furthermore,three representative integrated microsystems including energy harvester-PMSC,PMSC-energy consumption,and all-in-one selfpowered microsystems are elaborately overviewed to understand the emerging intelligent interaction models.Finally,the key perspectives,challenges and opportunities of PMSCs for powering smart microelectronics are proposed in brief.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
