摘要
为了解决高精度组合导航系统的体积和重量较大的问题,基于多层陶瓷基板高密度布线和三维立体组装等系统级封装(System In Package,SiP)工艺技术,提出了一种全新的三维立体微系统封装结构。采用低温共烧陶瓷(Low Temperature Cofired Ceramic,LTCC)基板高密度布线及贴装、基板堆叠、高正交度立体组装等SiP工艺,将三轴加速度计、三轴陀螺仪、卫星导航、地磁计和气压高度计等集成在一个封装单元中,研制出外形尺寸仅3.1 cm×2.9 cm×0.96cm、重量仅18g的组合导航微系统产品,拓展了应用领域。通过数据融合算法,可以有效提升导航精度和可靠性,具有广阔的应用前景。
In order to solve the problem of large volume and weight of high-precision integrated navigation system,a new 3D micro system packaging structure is proposed based on System in Package(SiP)technology such as multi-layer ceramic substrate,high-density wiring and 3D assembly.Using SIP processes such as Low Temperature Cofired Ceramic(LTCC)substrate high-density wiring and mounting,substrate stacking and high orthogonal assembly,the triaxial accelerometer,triaxial gyroscope,satellite navigation,geomagnetic meter and barometric altimeter are integrated into one packaging unit.The overall size of the integrated navigation microsystem product is only 3.1 cm×2.9 cm×0.96 cm,and the weighing is only 18 grams,and greatly expanded the application field.Through data fusion algorithms,navigation accuracy and reliability can be effectively improved,presenting broad application prospects.
作者
沈时俊
何一蕾
汪金华
庄永河
Shen Shijun;He Yilei;Wang Jinhua;Zhuang Yonghe(Anhui Province Key Laboratory of Microsystem,The 43rd Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China)
出处
《电子技术应用》
2025年第4期101-105,共5页
Application of Electronic Technique
基金
中国电子科技集团公司第四十三研究所2023年自主立项项目(2ZSS2325047)。
关键词
组合导航微系统
系统级封装
三维立体组装
低温共烧陶瓷
integrated navigation microsystem
System in Package(SiP)
3D assembly
Low Temperature Cofired Ceramic(LTCC)
作者简介
沈时俊(1983-),男,硕士,高级工程师,主要研究方向:惯性及组合导航微系统集成技术;通信作者:何一蕾(1993-),女,硕士,工程师,主要研究方向:信号电路设计,E-mail:heyoptael09@126.com;汪金华(1982-),男,硕士,研究员,主要研究方向:高精度信号测量电路。
