The characteristics of a disturbed soil-structure interface were studied based on the variation regularities of the disturbed soil within its mining subsidence area using direct shear tests.The effects of the initial ...The characteristics of a disturbed soil-structure interface were studied based on the variation regularities of the disturbed soil within its mining subsidence area using direct shear tests.The effects of the initial moisture content on the shear strength parameters of the soil-structure interfaces were analyzed.The results indicate that the cohesion of the interface initially increased and then decreased as the initial moisture content increased.In addition,the friction angle of the interface decreased as the initial moisture content increased.A constitutive model of the disturbed soil-structure interface,a rigid-plastic model based on the initial void ratio and saturability(VSRP) model,was established based on the results.In order to validate this model,a finite element analysis of DRS-1 direct shear tests was conducted.The finite element model calculations coincided with the results of the DRS-1 direct shear tests.The proposed model also reflected the nonlinear features of the soil-structure interface.展开更多
A filter cake is often formed between soil and concrete during casting concrete in the ground,such as constructions of diaphragm walls and bored piles.The present study aims to investigate the effect of the filter cak...A filter cake is often formed between soil and concrete during casting concrete in the ground,such as constructions of diaphragm walls and bored piles.The present study aims to investigate the effect of the filter cake on the shear behavior of the sand-concrete pile interface.A series of sand-concrete interface direct shear tests were performed with a large-direct shear apparatus while considering different roughness(I=0,10,20 and 30 mm)and filter cake thickness(Δh=0,5 and 10 mm).For a smooth interface without a filter cake,the shear stress-horizontal displacement curves showed a“softening”response.The peak shear strength and friction angle decreased exponentially with increasing theΔh.Whereas,for a rough interface withΔh=5 or 10 mm,the shear stress-horizontal displacement curves presented a“hardening”response.The peak strength,as well as friction angle,decreased linearly with increasing theΔh.Moreover,a critical roughness I_(cr)of 10 mm was observed in the tests without a filter cake.The interface shear strength initially increased with increasing I but gradually decreased when the I exceeded I_(cr).In addition,the filter cake could reduce the roughness sensitivity on shear strength.展开更多
The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that ...The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear展开更多
The predictive capacity of numerical analyses in geotechnical engineering depends strongly on the efficiency of constitutive models used for modeling of interfaces behavior.Interfaces are considered as thin layers of ...The predictive capacity of numerical analyses in geotechnical engineering depends strongly on the efficiency of constitutive models used for modeling of interfaces behavior.Interfaces are considered as thin layers of the soil adjacent to structures boundary whose major role is transferring loads from structures to soil masses.An interface model within the bounding surface plasticity framework and the critical state soil mechanics is presented.To this aim,general formulation of the interface model according to the bounding surface plasticity theory is described first.Similar to granular soils,it has been shown that the mechanical behavior of sand-structure interfaces is highly affected by the interface state that is the combined influences of density and applied normal stress.Therefore,several ingredients of the model are directly related to the interface state.As a result of this feature,the model is enabled to distinguish interfaces in dense state from those in loose state and to provide realistic predictions over wide ranges of density and normal stress values.In evaluation of the model,a reasonable correspondence between the model predictions and the experimental data of various research teams is found.展开更多
The electrical contact and mechanical performances of Ag-SnO_(2) contact materials are often improved by additives,especially Cu and its oxides.To reveal the improvement mechanism of metal additive,the effects of Cu n...The electrical contact and mechanical performances of Ag-SnO_(2) contact materials are often improved by additives,especially Cu and its oxides.To reveal the improvement mechanism of metal additive,the effects of Cu nanoparticles on the interface strength and failure behavior of the Ag-SnO_(2) contact materials are investigated by numerical simulations and experiments.Three-dimensional representative volume element(RVE)models for the Ag-SnO_(2) materials without and with Cu nanoparticles are established,and the cohesive zone model is used to simulate the interface debonding process.The results show that the stress−strain relationships and failure modes predicted by the simulation agree well with the experimental ones.The adhesion strengths of the Ag/SnO_(2) and Ag/Cu interfaces are respectively predicted to be 100 and 450 MPa through the inverse method.It is found that the stress concentration around the SnO_(2) phase is the primary reason for the interface debonding,which leads to the failure of Ag-SnO_(2) contact material.The addition of Cu particles not only improves the interface strength,but also effectively suppresses the initiation and propagation of cracks.The results have an reference value for improving the processability of Ag based contact materials.展开更多
The fracture behavior of polymer-bonded explosive(PBX) seriously affects the safety and reliability of weapon system.The effects of interface debonding and initial meso-damage on the fracture behavior of PBX under qua...The fracture behavior of polymer-bonded explosive(PBX) seriously affects the safety and reliability of weapon system.The effects of interface debonding and initial meso-damage on the fracture behavior of PBX under quasi-static tension are studied using numerical method.A twodimensional representative volume element(RVE) is established based on Voronoi model in which the component contents could be regulated and the particles are randomly distributed.A nonlinear damage model of polymer matrix relative to matrix depth between particles is constructed.The results show that the simulated strain-stress relation is coincident with experiment data.It is found that interface debonding leads to the nucleation and propagation of meso-cracks,and a main crack approximately perpendicular to the loading direction is generated finally.The interface debonding tends to occur in the interface perpendicular to the loading direction.There seems to be a phenomenon that strain softening and hardening alternatively appear around peak stress of stress and strain curve.It is shown that the initial damages of intragranular and interfacial cracks both decrease the modulus and failure stress,and the main crack tends to propagate toward the initial meso-cracks.展开更多
基金Project(51274192)supported by National Natural Science Foundation of China
文摘The characteristics of a disturbed soil-structure interface were studied based on the variation regularities of the disturbed soil within its mining subsidence area using direct shear tests.The effects of the initial moisture content on the shear strength parameters of the soil-structure interfaces were analyzed.The results indicate that the cohesion of the interface initially increased and then decreased as the initial moisture content increased.In addition,the friction angle of the interface decreased as the initial moisture content increased.A constitutive model of the disturbed soil-structure interface,a rigid-plastic model based on the initial void ratio and saturability(VSRP) model,was established based on the results.In order to validate this model,a finite element analysis of DRS-1 direct shear tests was conducted.The finite element model calculations coincided with the results of the DRS-1 direct shear tests.The proposed model also reflected the nonlinear features of the soil-structure interface.
基金Projects(51978672,51878671)supported by the National Natural Science Foundation of ChinaProject(2017zzts159)supported by the Graduate Innovation Program of Central South University,China+1 种基金Project(HNTY2021K09)supported by the Open Research Project of the Hunan Tieyuan Civil Engineering Testing Co.Ltd.,China。
文摘A filter cake is often formed between soil and concrete during casting concrete in the ground,such as constructions of diaphragm walls and bored piles.The present study aims to investigate the effect of the filter cake on the shear behavior of the sand-concrete pile interface.A series of sand-concrete interface direct shear tests were performed with a large-direct shear apparatus while considering different roughness(I=0,10,20 and 30 mm)and filter cake thickness(Δh=0,5 and 10 mm).For a smooth interface without a filter cake,the shear stress-horizontal displacement curves showed a“softening”response.The peak shear strength and friction angle decreased exponentially with increasing theΔh.Whereas,for a rough interface withΔh=5 or 10 mm,the shear stress-horizontal displacement curves presented a“hardening”response.The peak strength,as well as friction angle,decreased linearly with increasing theΔh.Moreover,a critical roughness I_(cr)of 10 mm was observed in the tests without a filter cake.The interface shear strength initially increased with increasing I but gradually decreased when the I exceeded I_(cr).In addition,the filter cake could reduce the roughness sensitivity on shear strength.
文摘The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear
文摘The predictive capacity of numerical analyses in geotechnical engineering depends strongly on the efficiency of constitutive models used for modeling of interfaces behavior.Interfaces are considered as thin layers of the soil adjacent to structures boundary whose major role is transferring loads from structures to soil masses.An interface model within the bounding surface plasticity framework and the critical state soil mechanics is presented.To this aim,general formulation of the interface model according to the bounding surface plasticity theory is described first.Similar to granular soils,it has been shown that the mechanical behavior of sand-structure interfaces is highly affected by the interface state that is the combined influences of density and applied normal stress.Therefore,several ingredients of the model are directly related to the interface state.As a result of this feature,the model is enabled to distinguish interfaces in dense state from those in loose state and to provide realistic predictions over wide ranges of density and normal stress values.In evaluation of the model,a reasonable correspondence between the model predictions and the experimental data of various research teams is found.
基金Projects(11872257,11572358)supported by the National Natural Science Foundation of ChinaProject(ZD2018075)supported by the Hebei Provincial Education Department,China。
文摘The electrical contact and mechanical performances of Ag-SnO_(2) contact materials are often improved by additives,especially Cu and its oxides.To reveal the improvement mechanism of metal additive,the effects of Cu nanoparticles on the interface strength and failure behavior of the Ag-SnO_(2) contact materials are investigated by numerical simulations and experiments.Three-dimensional representative volume element(RVE)models for the Ag-SnO_(2) materials without and with Cu nanoparticles are established,and the cohesive zone model is used to simulate the interface debonding process.The results show that the stress−strain relationships and failure modes predicted by the simulation agree well with the experimental ones.The adhesion strengths of the Ag/SnO_(2) and Ag/Cu interfaces are respectively predicted to be 100 and 450 MPa through the inverse method.It is found that the stress concentration around the SnO_(2) phase is the primary reason for the interface debonding,which leads to the failure of Ag-SnO_(2) contact material.The addition of Cu particles not only improves the interface strength,but also effectively suppresses the initiation and propagation of cracks.The results have an reference value for improving the processability of Ag based contact materials.
文摘The fracture behavior of polymer-bonded explosive(PBX) seriously affects the safety and reliability of weapon system.The effects of interface debonding and initial meso-damage on the fracture behavior of PBX under quasi-static tension are studied using numerical method.A twodimensional representative volume element(RVE) is established based on Voronoi model in which the component contents could be regulated and the particles are randomly distributed.A nonlinear damage model of polymer matrix relative to matrix depth between particles is constructed.The results show that the simulated strain-stress relation is coincident with experiment data.It is found that interface debonding leads to the nucleation and propagation of meso-cracks,and a main crack approximately perpendicular to the loading direction is generated finally.The interface debonding tends to occur in the interface perpendicular to the loading direction.There seems to be a phenomenon that strain softening and hardening alternatively appear around peak stress of stress and strain curve.It is shown that the initial damages of intragranular and interfacial cracks both decrease the modulus and failure stress,and the main crack tends to propagate toward the initial meso-cracks.
