The defence sector is now at an advanced level,catering to the global scenario,and countries also invest heavily in research and development.Countries around the world have spent a lot of money on research and develop...The defence sector is now at an advanced level,catering to the global scenario,and countries also invest heavily in research and development.Countries around the world have spent a lot of money on research and development over the years in order to stay ahead of their competitors.Lightweight materials are critical in defence applications because they allow components to be lighter without sacrificing strength.This review provides an overview of the research related to defence applications.The book provides comprehensive details on current trends in the application of lightweight materials in defence.This review also includes historical and current perspectives on defence technologies.It discusses uses of lightweight materials such as metal matrix composites,polymer composites,ceramic matrix composites,fiber composites in defence sectors Finally,the review paper also emphasizes future military applications of lightweight materials.展开更多
电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与...电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。展开更多
文摘The defence sector is now at an advanced level,catering to the global scenario,and countries also invest heavily in research and development.Countries around the world have spent a lot of money on research and development over the years in order to stay ahead of their competitors.Lightweight materials are critical in defence applications because they allow components to be lighter without sacrificing strength.This review provides an overview of the research related to defence applications.The book provides comprehensive details on current trends in the application of lightweight materials in defence.This review also includes historical and current perspectives on defence technologies.It discusses uses of lightweight materials such as metal matrix composites,polymer composites,ceramic matrix composites,fiber composites in defence sectors Finally,the review paper also emphasizes future military applications of lightweight materials.
文摘电子信息系统小型化、轻量化、无人化、一体化的发展趋势要求电子封装持续减小尺寸、降低重量和减少功耗(SWaP,即Size,Weight and Power)。传统的基于可伐合金、铝合金和高硅铝的微电子封装材料难以同时满足大跨度热匹配、良好的钎焊与激光熔焊性能、高导热、高比刚度、高比强度和良好的可制造性,无法适应SWaP要求。功能梯度铝基复合材料综合了铝合金与铝硅、碳化硅铝等先进复合材料的优点,既具备大跨度热匹配、高导热率的特点,又具备精细加工和良好的激光熔焊等工艺性能,是新一代微电子封装材料的研究热点。本文综述了功能梯度铝基复合材料的优势、制备方法和封装应用情况,并对该材料制备与应用中存在的问题进行了总结,最后对其未来研究方向进行了展望。
