研究纳秒脉冲电场生物学效应需要相应的高压纳秒脉冲发生器。为此,基于微带传输线与固态开关技术,通过波传播过程分析阐释了Blumlein型微带传输线方波的形成原理;采用CST微波实验室仿真分析了微带传输线充电过程中的电场分布;制作了小...研究纳秒脉冲电场生物学效应需要相应的高压纳秒脉冲发生器。为此,基于微带传输线与固态开关技术,通过波传播过程分析阐释了Blumlein型微带传输线方波的形成原理;采用CST微波实验室仿真分析了微带传输线充电过程中的电场分布;制作了小型化的纳秒脉冲发生器样机,并搭建测试系统对其进行了性能测试。结果表明,在电转杯负载端得到的纳秒脉冲电压幅值在0~2 k V内可调（即对间隙距离为1 mm的电转杯负载,电场强度在0~20 k V/cm内可调）,脉宽为100 ns,上升沿约为20 ns,重复频率在0~1 k Hz内可调。展开更多
The driving voltage and current signals of piezoceramic transducer (PZT) were measured directly by designing circuits from ultrasonic generator and using a data acquisition software system. The input impedance and pow...The driving voltage and current signals of piezoceramic transducer (PZT) were measured directly by designing circuits from ultrasonic generator and using a data acquisition software system. The input impedance and power of PZT were investigated by using root mean square (RMS) calculation. The vibration driven by high frequency was tested by laser Doppler vibrometer (PSV-400-M2). And the thermosonic bonding features were observed by scanning electron microscope (JSM-6360LV). The results show that the input power of bonding is lower than that of no load. The input impedance of bonding is greater than that of no load. Nonlinear phase, plastic flow and expansion period, and strengthening bonding process are shown in the impedance and power curves. The ultrasonic power is in direct proportion to the vibration displacement driven by the power, and greater displacements driven by high power (>5 W) result in welding failure phenomena, such as crack, break, and peeling off in wedge bonding. For thermosonic flip chip bonding, the high power decreases position precision of bonding or results in slippage and rotation phenomena of bumps. To improve reliability and precision of thermosonic bonding, the low ultrasonic power (about 1-5 W) should be chosen.展开更多
文摘研究纳秒脉冲电场生物学效应需要相应的高压纳秒脉冲发生器。为此,基于微带传输线与固态开关技术,通过波传播过程分析阐释了Blumlein型微带传输线方波的形成原理;采用CST微波实验室仿真分析了微带传输线充电过程中的电场分布;制作了小型化的纳秒脉冲发生器样机,并搭建测试系统对其进行了性能测试。结果表明,在电转杯负载端得到的纳秒脉冲电压幅值在0~2 k V内可调（即对间隙距离为1 mm的电转杯负载,电场强度在0~20 k V/cm内可调）,脉宽为100 ns,上升沿约为20 ns,重复频率在0~1 k Hz内可调。
基金Project(50675227) supported by the National Natural Science Foundation of ChinaProject(07JJ3091) supported by Natural Science Foundation of Hunan Province, China+1 种基金Project(2007001) supported by the State Key Laboratory of Digital Manufacturing Equipment and TechnologyProject(2009CB724203) supported by the Major State Basic Research Development Program of China
文摘The driving voltage and current signals of piezoceramic transducer (PZT) were measured directly by designing circuits from ultrasonic generator and using a data acquisition software system. The input impedance and power of PZT were investigated by using root mean square (RMS) calculation. The vibration driven by high frequency was tested by laser Doppler vibrometer (PSV-400-M2). And the thermosonic bonding features were observed by scanning electron microscope (JSM-6360LV). The results show that the input power of bonding is lower than that of no load. The input impedance of bonding is greater than that of no load. Nonlinear phase, plastic flow and expansion period, and strengthening bonding process are shown in the impedance and power curves. The ultrasonic power is in direct proportion to the vibration displacement driven by the power, and greater displacements driven by high power (>5 W) result in welding failure phenomena, such as crack, break, and peeling off in wedge bonding. For thermosonic flip chip bonding, the high power decreases position precision of bonding or results in slippage and rotation phenomena of bumps. To improve reliability and precision of thermosonic bonding, the low ultrasonic power (about 1-5 W) should be chosen.
