The trend in the radio frequency IC toward further miniaturization and improved performance drives ongoing technology innovation of new substrate and packaging technologies.In this paper,Hardware technology of RF syst...The trend in the radio frequency IC toward further miniaturization and improved performance drives ongoing technology innovation of new substrate and packaging technologies.In this paper,Hardware technology of RF system was reviewed,and the low temperature cofired ceramics(LTCC) technology was stated to be the best choice.Material development and measurement of Dielectric properties of LTCC technology are introduced.The application of passive embedded component was stated for RFIC design.Design of LTCC library will be the next step for RF system design and simulation.展开更多
文摘The trend in the radio frequency IC toward further miniaturization and improved performance drives ongoing technology innovation of new substrate and packaging technologies.In this paper,Hardware technology of RF system was reviewed,and the low temperature cofired ceramics(LTCC) technology was stated to be the best choice.Material development and measurement of Dielectric properties of LTCC technology are introduced.The application of passive embedded component was stated for RFIC design.Design of LTCC library will be the next step for RF system design and simulation.
