摘要
Nanocrystalline Cu-Ta alloy films were deposited on glass slides by magnetron sputtering. Microstructure characterization proved that most of the tantalum atoms are segregated in the grain boundaries. Nanoindentation creep measurements were performed on it to uncover the stability mechanism of grain boundary segregation on nanocrystalline materials. It is found that segregation can effectively slow down the creep strain rate and the grain boundary activities. The suppressed grain boundary activities endow the alloy with a stable microstructure during plastic deformation and annealing.
Nanocrystalline Cu-Ta alloy films were deposited on glass slides by magnetron sputtering. Microstructure characterization proved that most of the tantalum atoms are segregated in the grain boundaries. Nanoindentation creep measurements were performed on it to uncover the stability mechanism of grain boundary segregation on nanocrystalline materials. It is found that segregation can effectively slow down the creep strain rate and the grain boundary activities. The suppressed grain boundary activities endow the alloy with a stable microstructure during plastic deformation and annealing.
作者
Sufeng Wei
Xinming Hu
Xianglei Liu
Guoyong Wang
Sufeng Wei;Xinming Hu;Xianglei Liu;Guoyong Wang(Key Laboratory of Advanced Structural Materials, Changchun University of Technology, Changchun, China;Ansteel Group Iron and Steel Research Institute, Anshan, China;National Key Laboratory of Science and Technology on Helicopter Transmission, Nanjing University of Aeronautics and Astronautics, Nanjing, China;Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun, China)
