摘要
根据复合材料的强化原理 ,用Ag Cu Ti钎料和TiN颗粒作为复合连接材料在半固态下连接Si3N4复相陶瓷以提高接头强度 ,研究了接头的组织和界面反应。结果表明 ,接头由母材 反应层 含微量Ti的Ag Cu +TiN 反应层 母材组成 ,反应层由含Ti、Si、N三种元素的一些化合物组成 ;TiN颗粒在Ag Cu基体中的分布总体均匀 ,两者之间的界面清晰、结合致密 :当TiN的加入量较小时 ,对连接材料与母材的界面反应没有明显影响。初步的剪切试验结果表明 ,采用Ag Cu Ti加TiN颗粒作为复合连接材料连接Si3N4
Based on the reinforcement principles of composite materials,solid-liquid state bonding of Si-3N-4 ceramics was achieved with the composite bonding materials composed of Ag-Cu-Ti foils and TiN particulates to enhance the strength of joints.Microstructures and interfacial reactions of the joints were investigated.The results showed that the joint comprises substrate/reaction layer/Ag-Cu eutectic base containing little Ti+TiN/reaction layer/substrate.TiN particulates are generally well dispersed in the Ag-Cu eutectic base,and the interface between them is both clean and tight.Meanwhile,when ranging from 0 to 20%,the change in the volume of TiN particulates exerts no noticeable effects on the interfacial reaction between the Ag-Cu-Ti and the substrates.Preliminary results of shearing tests indicated that bonding of Si-3N-4 ceramics with the composite bonding materials discussed in this paper is capable of improving the strength of joints.
出处
《材料科学与工程学报》
CAS
CSCD
北大核心
2004年第2期157-160,共4页
Journal of Materials Science and Engineering
基金
国家自然科学基金资助项目 (50 0 750 4 6)
