摘要
MEMS器件大都含有可动的硅结构 ,在器件加工过程中 ,特别是在封装过程中极易受损 ,大大影响器件的成品率。如果能在MEMS器件可动结构完成以后 ,加上一层封盖保护 ,可以显著提高器件的成品率和可靠性。本文提出了一种用于MEMS芯片封盖保护的金 硅键合新结构 ,实验证明此方法简单实用 ,效果良好。该技术与器件制造工艺兼容 ,键合温度低 ,有足够的键合强度 ,不损坏器件结构 ,实现了MEMS器件的芯片级封装。
Most MEMS devices, i.e. accelerometer, micro gyroscope, have movable silicon structures, which are fragile and easily damaged in the fabrication process of devices,so that the yield will be decreased greatly. However, the yield and reliability can be increased if a layer of encapsulation is designed to protect the movable structures of MEMS devices. In this paper we design a new structure of Au Si wafer bonding for MEMS device packaging, it is proved that the process is simple and the result is satisfied. This technique is compatible with regular MEMS devices fabrication process, achieves adequate intensity, will not damage the micro mechanical structures, its bonding temperature is lower and can realize wafer level packaging of the MEMS device. It has been already used in the fabrication of micro gyroscope successfully.
出处
《微纳电子技术》
CAS
2003年第7期238-240,248,共4页
Micronanoelectronic Technology
作者简介
刘雪松 (1980-), 男,天津人,现就读于北京大学信息科学技术学院微电子学系,从事微电子机械系统方面的研究; 闫桂珍 女,北京大学教授,博士生导师,主要研究方向包括双极超高速集成电路和CMOS电路的设计与工艺技术研究,MEMS惯性传感器,气体传感器研究等课题,已发表论文50余篇.E-mail:gzyan@ime.pku.edu.cn
