摘要
针对现有雷达高频接收组件尺寸大、集成度不高的情况,采用低温共烧陶瓷(LTCC)多层基板、单片微波集成电路(MMIC)芯片和微组装技术,设计和实现了C波段LTCC高频前端模块。该模块采用二次混频方案,包含限幅器、放大器、滤波器、衰减器、混频器等;其中主要器件用MMIC芯片实现,滤波器埋置在LTCC多层基板中实现,极大减小了模块的尺寸,模块最终尺寸为64 mm×20 mm×1.1 mm,比现有的接收组件尺寸减小了50%。经测试,该LTCC高频前端模块的增益大于40 d B,带内平坦度小于2 d B,噪声系数小于5 d B,镜像抑制度优于51 d B。可将高频前端模块应用于雷达高频接收组件中,从而减小组件尺寸。
As current radar receivers are bulky and low integrated, Low Temperature Co-fired Ceramic(LTCC) multilayer substrates, Monolithic Microwave Integrated Circuit(MMIC) chips and microassembly technology are adopted to design and develop a C band front-end module. This module utilizes superheterodyne scheme, including a limiter, amplifiers, filters, attenuators and mixers. Most of the main components are using MMIC chips, and filters are integrated into LTCC multilayer substrates, which can greatly reduce the size of the module. The size of the prototype is 64 mm×20 mm×1.1 mm, with 50%reduction in size comparing to the current ones. The module is measured and has a gain of 40 d B with a flatness of ±1 d B, NF of 5 d B, image rejection of 51 d Bc. The module can be used in radar receivers, which reduces the size of current receivers.
出处
《太赫兹科学与电子信息学报》
2016年第1期72-75,共4页
Journal of Terahertz Science and Electronic Information Technology
