摘要
在分析硅衬底的抛光机理的基础上,主要讨论了抛光液对硅衬底抛光质量的影响,同时对抛光液中各成分的选择作了分析研究,采用不含钠离子的有机碱和高效的无钠螯合剂减少了金属离子的玷污,对活性剂影响吸附的作用机理进行了分析,得到了一种小粒径、高速率和低损伤的无钠抛光液。
Based on the analysis of mechanism of silicon polishing, this paper discusses the influence of polishing slurry on polishing quality. The selection of components in the polishing slurry are discussed. In order to reduce pollution caused by metallic ions, the alkali and chelating agent without sodium ions are adopted. The relation between adsorption mechanism and the surfactants is analyzed. As a result, the new nonsodium polishing slurry with small particle size, high polishing rate and high quality is realized.
出处
《石家庄铁道学院学报》
2003年第4期38-41,共4页
Journal of Shijiazhuang Railway Institute
