摘要
本文采用正交实验及其分析方法研究了可调周期换向脉冲电镀工艺对瓦特镍镀层应力的影响,确定了脉冲镀镍的新工艺。与相同电流密度条件下直流镀瓦特镍层的性能相比,该工艺镀出的镀层具有应力低、孔隙少、结晶细、平整度好、纯度高的特点,是解决半导体外壳外引线断裂问题的很有前途的电镀新方法。
The effect of plating technology with adjustable periodic reverse pulse current on the internal stress of the nickel deposits was studied and the plating parameters were established. Compared with the direct current plating, the nickel coatings deposited with this technology is characterized by lower internal stress, less porosity, finer grain, higher smoothness and purity.
出处
《电镀与精饰》
CAS
1992年第3期22-25,共4页
Plating & Finishing
关键词
换向脉冲
电镀镍
镀镍
镀层应力
reverse pulse
electroplated nickel
coating stress
