摘要
采用光固化技术增材制造SiCp/Al6061,研究了树脂单体和固相体积分数对SiCp/Al6061浆料稳定性、流变性能、光固化性能以及烧结体致密度与微观组织的影响。结果表明,适宜的浆料体系为混合光敏树脂体系PEG200DA/PEG400DA(1∶1);采用该光敏树脂体系制备固含量为52.5%的浆料,黏度为5.05 Pa·s(剪切速率10 s^(-1))、单层固化厚度为100.3μm,满足光固化增材制造的要求。光固化增材制造的SiC_(p)/Al零件坯体形状完整、层间结合好,烧结体无开裂现象,烧结颈明显,致密度较高(94.07%)。
The additive manufacturing of SiCp/Al606 by photocuring process was studied,and the effects of resin monomer and solid volume fraction on the stability,rheological properties and photocuring performance of SiCp/Al6061 slurry,as well as the compactness and microstructure of sintered product were explored.The results show that as photosensitive resins of PEG200DA and PEG400DA mixed at an appropriate ratio of 1∶1,the prepared slurry with content of 52.5%,viscosity of 5.05 Pa·s(shear rate of 10 s^(-1))and single-layer curing thickness of 100.3μm can meet the requirements for photocuring in additive manufacturing.The SiC_(p)/Al component manufactured by photocuring process can have a complete structure and good interlayer bonding,and the sintered product with no cracks and obvious necking presents relatively high compactness(94.07%).
作者
乔聪卓
刘子瑞
徐麒凯
王日初
彭超群
王小锋
QIAO Congzhuo;LIU Zirui;XU Qikai;WANG Richu;PENG Chaoqun;WANG Xiaofeng(School of Materials Science and Engineering,Central South University,Changsha 410083,Hunan,China)
出处
《矿冶工程》
北大核心
2025年第4期168-174,179,共8页
Mining and Metallurgical Engineering
基金
福建省重大科技专项(2023HZ021005)。
关键词
浆料
6061铝合金
碳化硅颗粒
增材制造
光固化
立体光刻
slurry
6061 aluminum alloy
silicon carbide particle
additive manufacturing
photocuring
stereolithograpy
作者简介
乔聪卓(1999-),男,河北邢台人,硕士研究生,主要研究方向为铝基复合材料增材制造。E⁃mail:qiao1151989420@163.com;通信作者:王小锋(1980-),男,湖北天门人,博士,教授,主要从事增材制造和金属基复合材料等方面的研究。E⁃mail:wangxiaofeng@csu.edu.cn。
