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旋转永磁场对Au_(25)Cu_(75)合金表面质量及微观组织的影响

Effect of rotating magnetic field on surface quality and microstructure of Au_(25)Cu_(75) alloy
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摘要 在Au_(25)Cu_(75)前驱体合金凝固过程中施加旋转永磁场,研究了永磁搅拌参数对合金枝晶组织及表面质量的影响,并分析了前驱体微观组织与纳米多孔金结构的关系。结果表明,施加旋转永磁场可显著改善Au_(25)Cu_(75)合金表面质量,减少表面凹坑数量,提高表面光洁度。在洛伦兹力作用下,Au_(25)Cu_(75)合金熔体微观组织显著细化,二次枝晶臂间距降低了33%,枝晶尺寸分布更均匀,缩松缩孔、裂纹等铸造缺陷也得到有效抑制。此外,晶粒细化且成分均匀的前驱体合金在去合金化过程中更利于获得均匀的韧带/孔结构。 During the solidification process of Au_(25)Cu_(75) precursor alloy,a rotating permanent magnetic field was applied to investigate the influence of permanent magnetic stirring parameters on the dendritic structure and surface quality of the alloy,and the relationship between the microstructure of the precursor and the nanoporous gold structure was analyzed.The results indicated that the application of rotating permanent magnetic field significantly improved the surface quality of Au_(25)Cu_(75) alloy,reduced the number of surface pits,and increased surface smoothness.Under the action of Lorentz force,the microstructure of Au_(25)Cu_(75) alloy melt was significantly refined,the spacing between secondary dendrite arms was reduced by 33%,the dendrite size distribution was more uniform,and casting defects such as shrinkage porosity and cracks were effectively suppressed.In addition,precursor alloys with refined grain size and uniform composition were more conducive to obtaining uniform ligament/pore structures during the dealloying process.
作者 刘继龙 张俊凯 庞启航 李维娟 厉英 郑伟 LIU Jilong;ZHANG Junkai;PANG Qihang;LI Weijuan;LI Ying;ZHENG Wei(School of Materials and Metallurgy,University of Science and Technology Liaoning,Anshan 114051,China;School of Metallurgy,Northeastern University,Shenyang 110819,China;Yingkou Zhongwang Aluminum Industry Co.,Ltd.,Yingkou 115000,China)
出处 《江西冶金》 2025年第4期274-280,共7页 Jiangxi Metallurgy
基金 辽宁省自然科学基金项目(2019-KF-05-08) 辽宁科技大学大学生创新创业训练计划项目(S202410146018)。
关键词 磁场 Au_(25)Cu_(75)合金 表面质量 纳米多孔金 magnetic field Au_(25)Cu_(75)alloy surface quality nanoporous gold
作者简介 通信作者:张俊凯,副教授,主要从事高性能材料加工制备、材料腐蚀与防护等方面的研究。E-mail:zhangjk@ustl.edu.cn。
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