摘要
为解决产品印制板检验合格后无法进行安装调试的问题,开展了印制板可装配性工艺设计。以某产品控制板为例,给出了控制板布局可装配性设计规则值,重新对控制板焊装和PCB布局工艺进行设计,并对此工艺设计方案进行可装配性评价及分析。结果表明,忽略装配环境结构尺寸对产品印制板工艺设计的影响,印制板焊装工艺很有可能无法指导现场生产顺利进行,批生产过程中才发现PCB布局设计错误,需要重新研发和生产的几率很大,现有的印制板工艺设计无法满足产品印制板生产质量要求。面向产品的印制板可装配性工艺设计对于装配环境复杂紧凑的产品印制板非常有必要。
A process design for the assemblability of printed circuit boards is carried out to settle the matter that printed board cannot be installed and debugged after passing inspection.Taking the control board of a certain type of products as an example,the assembly design constraint numbers are calculated for control board PCB layout,redesigning the soldering and PCB layout process for controller board,and the assemblability of this process design scheme is evaluated and analyzed.The results indicate that ignoring the influence of structure size of assembly environment on the process design of product printed circuit boards,the PCB soldering process is likely to fail to guide smooth on-site production.PCB layout design errors are only discovered during batch production,and there is a high probability that they need to be redeveloped and produced.The existing PCB process design cannot meet the quality requirements of product printed circuit board production,and it is very necessary to proceed product-oriented assembly process design on printed board that assembly environment is complex and compact of the products.
作者
袁亦青
李芊蓉
成晶亮
张苗苗
YUAN Yiqing;LI Qianrong;CHENG Jingliang;ZHANG Miaomiao(Department of Electrical,Northwest Institute of Mechanical&Electrical Engineering,Xianyang 712000,China)
出处
《电子工艺技术》
2025年第4期30-33,41,共5页
Electronics Process Technology
作者简介
袁亦青(1991-),女,硕士,工程师,主要从事电子装备的工艺研究与设计工作。
