摘要
农用电动皮卡的高扭矩、高功率的应用需求给电驱动系统带来了极大挑战,其中的核心部件逆变功率模块的性能至关重要。为解决功率模块发热量过大等问题,仿真分析了硅(Si)基逆变模块的封装结构,提出了多种碳化硅(SiC)基逆变模块的芯片布局方案,对比分析了不同布局结构下逆变模块的热、电性能。仿真结果表明,芯片总功率不变时,芯片数量增加和布局优化能使模块的最高温度降低约12℃,寄生电感也大幅降低。该研究为未来农用电动皮卡中的SiC基逆变模块封装提供了参考。
The high-torque and high-power requirements of agricultural electric pickup trucks pose significant challenges for electric drive systems,with the inverter power module being a critical component.A simulation and analysis of the packaging structure were conducted to address issues such as excessive heat generation in silicon(Si)based inverter modules.Various chip layout configurations for silicon carbide(SiC)based inverter modules were proposed to compare thermal and electrical performances.Simulation results indicated that,with a constant total chip power,increasing the number of chips and optimizing the layout reduced the module’s maximum temperature by approximately 12℃and minimized parasitic inductance.This study provided an important reference for the packaging of SiC based inverter modules for future agricultural electric pickup trucks.
作者
闫志豪
鲍婕
周云艳
YAN Zhihao;BAO Jie;ZHOU Yunyan(College of Intelligent Manufacturing,Anhui Science and Technology University,Chuzhou 233100,China;College of Mechanical and Electrical Engineering,Huangshan University,Huangshan 245041,China)
出处
《邵阳学院学报(自然科学版)》
2025年第2期52-57,共6页
Journal of Shaoyang University:Natural Science Edition
基金
安徽省教育厅重大项目(2022AH040270)
智能微系统安徽省工程技术研究中心开发研究项目(ETRCIM202303)。
关键词
农用皮卡
SiC逆变模块
散热
寄生电感
仿真
agricultural pickup truck
SiC based inverter module
heat dissipation
parasitic inductance
simulation
作者简介
闫志豪,男,硕士研究生,从事农用电动车功率模块封装技术的研究,E-mail:819108952@qq.com;通信作者:鲍婕,女,教授,博士,从事半导体封装技术的研究,E-mail:baojiehsu@hsu.edu.cn。
