摘要
随着通信设备向便携化、轻薄化发展,对SAW芯片的小体积、高性能需求逐渐增加,为确保产品交付质量,需要在芯片研发、生产过程中开展有效的质量控制和可靠性测试。通过对SAW芯片故障模式及影响的分析,找出了设计和生产过程存在的风险点,制定质量控制措施并研究可靠性测试方法,提升了芯片合格率,进而验证了质量控制措施和可靠性测试方法的有效性,在业内具有一定的借鉴意义。
As communication devices continue to advance toward greater portability and slimmer designs,the demand for smaller,high-performance surface acoustic wave(SAW)chips has consistently increased.To ensure product quality,implementing effective quality control and reliability testing throughout the chip development and manufacturing processes is essential.An analysis of the failure modes and effects of SAW chips identifies potential risks during both the design and production stages.Based on these findings,appropriate quality control measures were established,and reliability testing methods were developed to improve the chip yield.The effectiveness of these quality control and reliability testing methods has been validated,offering valuable insights for the industry.
作者
艾毅智
杨怡
陈虹羽
AI Yizhi;YANG Yi;CHEN Hongyu(CETC Chips Technology Group Co.,Ltd.,Chongqing 401332,China)
出处
《压电与声光》
北大核心
2025年第1期92-97,共6页
Piezoelectrics & Acoustooptics
作者简介
艾毅智(1973-),女,本科,高级工程师。
