摘要
利用硅氢加成反应合成了一种酚羟基聚硅氧烷(poly(DMS-alt-BPA)),采用红外光谱、核磁共振氢谱对其化学结构进行了表征。进一步将其作为改性剂添加到双酚A型环氧树脂(E51)/甲基六氢苯酐(MeHHPA)固化体系中,对体系的固化行为及固化物的热稳定性、热机械性能、力学性能进行了研究。结果表明,poly(DMS-altBPA)可以参与体系的固化反应,且不会明显影响固化行为。poly(DMS-alt-BPA)的加入可有效增韧环氧树脂固化物,同时固化物能够保持较高的玻璃化转变温度和热稳定性。与纯的环氧树脂固化物相比,含有质量分数10%poly(DMS-alt-BPA)的环氧树脂固化物的弯曲强度和冲击强度分别提升了70%和117.9%,但弯曲模量有所降低。因此,poly(DMS-alt-BPA)作为一种新型增韧剂在电子封装材料领域具有良好的应用前景。
A phenolic hydroxyl-containing polysiloxane(poly DMS-alt-BPA)was synthesized by silicon-hydrogen addition reaction,and its chemical structure was characterized by FT-IR and1H-NMR.Furthermore,the poly(DMS-alt-BPA)was added as a modifier to bisphenol A epoxy resin(E51)/methylhexahydrophthalic anhydride(MeHHPA)curing system.The curing behavior of the system and the thermal stability,thermal-mechanical properties,and mechanical properties of the cured material were studied.The results showed that the poly(DMS-alt-BPA)could participate in the curing reaction of the system,and scarcely affected the curing behavior.The addition of poly(DMS-alt-BPA)could effectively toughen the epoxy thermosets,while the materials maintained a high glass transition temperature and thermal stability.Compared with pure epoxy thermoset,the flexural strength and impact strength of cured epoxy resins containing10 wt% poly(DMS-alt-BPA)increased by 70% and 117.9%,respectively,but the flexural modulus decreased.Therefore,as a new toughening agent,the poly(DMS-alt-BPA)has good application prospect in the field of electronic packaging materials.
作者
谢凯丽
黄家腾
李珍珍
刘敬成
李小杰
魏玮
XIE Kai-li;HUANG Jia-teng;LI Zhen-zhen;LIU Jing-cheng;LI Xiao-jie;WEI Wei(School of Chemical and Material Engineering,Jiangnan University,Wuxi 214122,China)
出处
《热固性树脂》
CAS
CSCD
2024年第5期21-29,共9页
Thermosetting Resin
基金
2018年江苏省产学研合作项目(BY 218041)。
关键词
酚羟基聚硅氧烷
环氧树脂
酸酐
电子封装
增韧
耐热性
phenolic hydroxyl-containing polysiloxane
epoxy resin
anhydride
electronic packaging
toughening
heat resistance
作者简介
谢凯丽(1998-),女,江西宜春人,硕士研究生,主要研究方向为功能聚硅氧烷的设计合成及其改性环氧树脂应用;通讯作者:魏玮,E-mail:wwei1985@jiangnan.edu.cn。
