摘要
针对航空电子产品印制板组件焊点脱焊问题,以高密度BGA器件为研究对象,分析了导致焊点脱焊的主要原因,在于产品结构设计和工艺设计不当导致的应变应力及产品服役过程中的机械振动、热循环应力,其次是焊接过程中的不良特性。本文针对性提出了相关预防措施,并指明了下一步技术研究的工作方向。
In order to solve the problem of solder joint dewelding in printed circuit board components of aviation electronics products,the causes of solder joint dewelding are analyzed with high density BGA devices as the research object.The main cause of solder joint dewelding is the strain stress caused by improper product structure design and process design,mechanical vibration and thermal cycle stress during product service,and the second is poor welding process.The relevant preventive measures are put forward,and the direction of further technical research is pointed out.
作者
王大伟
王晨
徐子强
李德雄
费盟
WANG Da-wei;WANG Chen;XU Zi-qiang;LI De-xiong;FEI Meng(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China)
出处
《航空电子技术》
2024年第3期62-66,共5页
Avionics Technology
关键词
BGA器件
脱焊
虚焊
可靠性
BGA
dewelding
virtual welding
reliability
