摘要
                
                    综述了Cu基电触头材料的研究进展,介绍和分析了中高压开关用铜基触头材料的发展过程与种类,重点介绍了Cu-Cr、CuW以及Cu-氧化物触头,并进一步对其制备工艺进行分析,比较不同研究方法的优缺点。最后提出了表面改性处理和多组元微合金化是目前我国铜基触头材料和制备工艺的发展方向。
                
                The research progress in Cu-based electrical contact materials was reviewed,and the development process and classification of Cu-based contact materials for medium and high-voltage vacuum switches were introduced and analyzed,focusing on Cu-Cr,Cu-W,and Cu-oxide contacts.The preparation process was further analyzed,and the advantages and disadvantages of different research methods were compared.Finally,it is concluded that the surface modification treatment and multi-component microalloying are regarded as development direction of Cu-based contact materials and preparation process.
    
    
                作者
                    夏春勇
                    杨长龙
                    多俊龙
                    豆志河
                    张廷安
                    韩金儒
                    安旺
                Xia Chunyong;Yang Changlong;Duo Junlong;Dou Zhihe;Zhang Ting'an;Han Jinru;An Wang(Shenyang Power Supply Company of State Grid Liaoning Province Electric Power Co.,Ltd.,Shenyang 110002;School of Metallurgy,Northeastern University,Shenyang 110819)
     
    
    
                出处
                
                    《特种铸造及有色合金》
                        
                                CAS
                                北大核心
                        
                    
                        2024年第5期598-605,共8页
                    
                
                    Special Casting & Nonferrous Alloys
     
            
                基金
                    国家电网有限公司科技资助项目(SGLNDK00SPJS2250022)。
            
    
                关键词
                    Cu基电触头材料
                    表面改性
                    微合金化
                
                        Cu-based Electrical Contact Materials
                        Surface Modification
                        Microalloying
                
     
    
    
                作者简介
第一作者:夏春勇,男,1975年出生,高级工程师,E-mail:675900795@qq.com。