摘要
首次开展太赫兹金刚石-无氧铜盒型输能窗研究,利用低损耗的无氧铜材料代替传统可伐合金材料,显著降低输能窗传输损耗、提高器件输出功率。为降低无氧铜与金刚石热膨胀系数严重不匹配造成的封接应力,提出一种多槽应力释放结构,将金刚石表面封接应力由210 MPa减小至50 MPa,小于金刚石与无氧铜组合抗拉件的平均封接强度116.2 MPa。根据设计结果,开展金刚石-无氧铜输能窗封接试验,氦漏率≤1×10^(-11)(Pa·m^(3))/s,实现了气密封接。测试金刚石-无氧铜输能窗传输损耗为0.7 dB,比采用金刚石-可伐输能窗的传输损耗减小2 dB,即输出功率可以提高60%,为研制大功率太赫兹源奠定了重要关键技术基础。
In order to decrease the transfer loss of RF window and improve the output power of terahertz vacuum electronic devices,dia⁃mond⁃oxygen free high conductance copper(OFHC)pill⁃box RF window in terahertz regime is studied for the first time.A multi⁃slot structure is proposed to reduce the sealing stress which is caused by the mismatch of the thermal expansion coefficient between diamond and OFHC.The simulation predicts that the multi⁃slot structure reduces sealing stress from 210 MPa to 50 MPa,which is lower than the average sealing strength of diamond⁃OFHC tensile piece.After the sealing experiment,the RF window is proved to be airtight with a he⁃lium leak rate lower than 1×10^(-11)(Pa·m^(3))/s.The measurement result shows that the diamond⁃OFHC RF window is 2 dB less transfer loss than diamond⁃Kovar RF window,which means that the output power is increased by 60%.This research settles an essential techno⁃logical foundation for developing high power terahertz resource.
作者
张琳
蔡军
潘攀
冯进军
ZHANG Lin;CAI Jun;PAN Pan;FENG Jinjun(National Key Laboratory of Science and Technology on Microwave Vacuum Electronic Device,Beijing Vacuum Electronics Research Institute,Beijing 100015,China)
出处
《电子器件》
CAS
2024年第2期314-318,共5页
Chinese Journal of Electron Devices
关键词
太赫兹
盒型输能窗
金刚石
无氧铜
多槽应力释放结构
terahertz
pill⁃box RF window
diamond
oxygen free high conductance copper
multi⁃slot structure
作者简介
张琳(1990-),内蒙古赤峰人,硕士,高级工程师,在职博士生,主要从事太赫兹真空器件方向的研究,zhanglin0991@qq.com。
