摘要
利用光学显微镜(OM)、透射电镜(TEM)和电导率测试等研究了添加微量合金化元素对4N纯铜的晶粒尺寸热稳定性和导电性的影响,分析了合金元素与基体中微量杂质元素S的相互作用。结果表明:添加微量Ti元素及微量Cr、Ni和Ag元素均可显著提高4N纯铜晶粒尺寸的热稳定性,经900℃×30 min高温处理后,Cu、Cu-Ti和Cu-Cr-Ni-Ag的晶粒尺寸分别为158.57、86.06和48.35μm,即热稳定性Cu-Cr-Ni-Ag>Cu-Ti>Cu。同时,添加微量合金化元素后纯铜的导电率仍较高,Cu、Cu-Ti和Cu-Cr-Ni-Ag导电率分别为101.87、101.64和99.98%IACS。分析认为热稳定性的提高主要与TiS相、CrS相的钉扎以及Ni和Ag固溶拖拽有关,微量Ti和Cr可与杂质S反应形成六方结构TiS相和单斜结构CrS相,且均与基体呈非共格关系,特别是CrS相较TiS相更为细小、数量更多。
Effect of adding trace alloying elements on thermal stability of grain size and electrical conductivity of 4N pure copper was studied using optical microscope(OM),transmission electron microscopy(TEM)and electrical conductivity testing.The interaction between alloying elements and trace impurity element S in the matrix was analyzed.The results show that both the addition of trace Ti element and co-addition of trace Cr,Ni and Ag elements can significantly improve the thermal stability of the grain size of the 4N pure copper.After high-temperature treatment at 900℃for 30 min,,the grain sizes of the Cu,Cu-Ti,and Cu-Cr-Ni-Ag are 158.57,86.06 and 48.35μm,respectively,shows the thermal stability is Cu-Cr-Ni-Ag>Cu-Ti>Cu.Meanwhile,the electrical conductivity of the 4N pure copper remains high after adding trace alloying elements,and the electrical conductivity of the Cu,Cu-Ti and Cu-Cr-Ni-Ag is 101.87%IACS,101.64%IACS and 99.98%IACS,respectively.Analysis suggests that the improvement of thermal stability is mainly related to the pinning effect of TiS phase and CrS phase,as well as the solid solution drag effect of Ni and Ag.Trace Ti and Cr elements can react with impurity S to form hexagonal TiS phase and monoclinic CrS phase,both of which exhibit a non-coherent relationship with the matrix,especially the CrS phase is smaller and more numerous than TiS phase.
作者
梁十军
刘海涛
张彦敏
宋克兴
郭慧稳
郭引刚
LIANG Shi-jun;LIU Hai-tao;ZHANG Yan-min;SONG Ke-xing;GUO Hui-wen;GUO Yin-gang(School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China;Henan Academy of Sciences,Zhengzhou 450000,China;Chinalco Luoyang Copper Processing Co Ltd,Luoyang 471039,China;Henan Zhongyuan Gold Smelter Co Ltd,Sanmenxia 472100,China)
出处
《材料热处理学报》
CAS
CSCD
北大核心
2024年第4期61-69,共9页
Transactions of Materials and Heat Treatment
基金
河南省重点研发专项(221111230600)
中原学者工作站项目(224400510025)
洛阳市重大科技创新专项(2201017A)
国家自然科学基金(52071133)。
关键词
纯铜
微合金化元素
电导率
热稳定性
析出相
pure copper
trace alloying element
conductivity
thermal stability
precipitated phase
作者简介
梁十军(1992-),男,硕士研究生,主要从事材料组织性能研究,E-mail:13938930573@163.com;通信作者:刘海涛(1986-),男,副教授,博士,主要从事冶金与材料性能调控研究,E-mail:htliu@haust.edu.cn。
