摘要
对化学机械抛光(CMP)工艺中的抛光垫特性、劣化以及修整进行了简单阐述,重点先从抛光垫表面特性(抛光垫表面微形貌、微孔及抛光垫的结构、表面沟槽纹理的形状、微凸体的分布)和材质特性(硬度、弹性模量和化学性能)入手,对近年来国内外的实验研究与理论模拟分析两方面进行了概括,总结了目前各个特性参数对抛光垫性能以及对CMP过程影响的进展,此外,从机械磨损和化学腐蚀两方面对抛光垫的劣化机理进行简要分析。随后,为进一步探究抛光垫修整对抛光性能影响,对抛光垫的两种修整方式和修整参数对修整的效果进行了归纳,介绍了几种新型自修整材料。最后,指出了抛光垫特性和修整在发展现状中存在的问题,未来抛光垫的发展趋势将逐渐走向创新化、智能化、理论化以及应用集成化。
The characteristics,deterioration and conditioning of polishing pad in chemical mechanical polishing(CMP)process are briefly described,focusing on the surface characteristics of polishing pad(surface micro-morphology of polishing pad,micropore and structure of polishing pad,shape of surface groove texture,distribution of micro-convex body)and materia characteristics(hardness,elastic modulus and chemical properties).The recent domestic and foreign experimental research and theoretical simulation analyses are summarized,and current progress of the influences of various characteristic parameters on polishing pad performance and CMP process is summarized.In addition,the deterioration mechanism of polishing pad is briefly analyzed from two aspects of mechanical wear and chemical corrosion.Then,in order to further explore the influence of polishing pad conditioning on polishing performance,the effects of two polishing pad conditioning methods and conditioning parameters on conditioning effect are summarized,and several new self-conditioning materials are introduced.Finally,the problems existing in the characteristics and conditioning of the polishing pad are pointed out,and the development trend of the polishing pad in the future will gradually move towards innovation,intelligence,theorization and application integration.
作者
梁斌
高宝红
刘鸣瑜
霍金向
李雯浩宇
贺斌
董延伟
Liang Bin;Gao Baohong;Liu Mingyu;Huo Jinxiang;Li Wenhaoyu;He Bin;Dong Yanwei(School of Electronic and Information Engineering,Hebei University of Technology,Tianjin 300130,China;Tianjin Key Laboratory of Electronic Materials and Devices,Tianjin 300130,China)
出处
《微纳电子技术》
CAS
2024年第4期38-48,共11页
Micronanoelectronic Technology
基金
国家自然科学基金(61704046)。
关键词
化学机械抛光(CMP)
抛光垫
表面特性
材质特性
修整
chemical mechanical polishing(CMP)
polishing pad
surface characteristic
material property
conditioning
作者简介
梁斌(1998—),男,河南三门峡人,硕士研究生,主要研究方向为微电子技术与材料;通信作者:高宝红(1982—),女,山东惠民人,博士,副研究员,主要研究方向为微电子技术与材料。
