摘要
采用芯片倒装的形式可以有效解决高功率微波芯片系统级封装(SIP)的散热问题,但基于厚膜工艺的LTCC/HTCC封装基板与倒装芯片存在尺寸失配、无法直接互联的问题.为此设计了一种基于厚薄膜混合技术的封装基板.首先通过内部采用传统厚膜工艺、表面采用薄膜布线工艺的厚薄膜混合技术解决了芯片与封装基板尺寸失配的问题;然后对与芯片匹配的带地共面波导(CPWG)尺寸进行设计,采用梯形过渡结构使之与封装基板垂直过孔尺寸匹配;最后通过热仿真验证了该结构的系统散热性能.仿真结果表明,在射频性能良好情况下,本文封装结构散热性能优于传统形式封装.
The heat dissipation problem of high-power microwave chip system-in-package(SIP)can be effectively solved by adopting the form of chip flip,but LTCC/HTCC packaging substrates based on thick film technology and flip chips have the problem of size mismatch and inability to directly interconnect.In view of the above problems,a packaging substrate based on thick/thin-film hybrid technology is designed.Firstly,the problem of size mismatch between the chip and the packaging substrate is solved by using the traditional thick film technology inside and thin film wiring technology on the surface.Then,the size of ground co-planar waveguide(CPWG)matching the chip is designed;a trapezoidal transition structure is used to match it with the vertical through-hole size of the packaging substrate.Finally,the thermal simulation is conducted to verify the heat dissipation performance of the system.The simulation results show that under the condition of good RF performance,the heat dissipation performance of the packaging structure designed in this paper is better than that of the traditional packaging.
作者
张磊
肖磊
ZHANG Lei;XIAO Lei(Third Military Representative Office of Naval Armament Department in Nanjing Area,Nanjing 210001,China;Nanjing Research Institute of Electronics Technology,Nanjing 210039,China;Jiangsu Multi-dimensional Perception Information Technology Joint Laboratory,Nanjing 210039,China)
出处
《空天预警研究学报》
CSCD
2023年第6期438-441,共4页
JOURNAL OF AIR & SPACE EARLY WARNING RESEARCH
关键词
系统级封装
芯片倒装
厚薄膜混合技术
垂直过渡结构
带地共面波导
散热
system-in-package
chip flip
thick/thin-film hybrid technology
vertical transition structure
ground co-planar waveguide
heat dissipation
作者简介
张磊(1982-),男,硕士,主要从事雷达、电子元器件方面研究.
