摘要
为保证芯片的工作温度在安全范围内,研究利用微热管阵列(MHPA)设计了用于芯片热管理的散热装置。通过实验测试了不同蒸发端长度和充液率对单L型和U型MHPA散热器传热性能的影响,并对双L-MHPA和U-MHPA芯片散热器进行不同倾角的传热性能对比实验。结果表明:过高的充液率和过长的蒸发端长度均降低了MHPA散热器的传热能力,水平放置时的U1-MHPA芯片散热器具有最佳的传热性能,在160 W的加热功率下,散热器平均热阻为89.6 K/(W·m^(2)),散热器能稳定芯片的温度在57.9℃。双L型散热器具有更好的倾角适应能力。
To ensure that the operating temperature of the chip is within a safe range,this study designed a heat dissipation device for chip thermal management using a micro heat pipe array(MHPA).The effects of different evaporation end lengths and liquid filling rates on the heat transfer performance of single L-MHPA and U-MHPA heat sinks were experimentally tested,and the heat transfer performance of dual L-MHPA and U-MHPA chip heat sinks with different inclination angles was compared.The results show that both excessively high liquid filling rate and excessively long evaporation end length reduce the heat transfer capacity of MHPA heat sink;The U_1-MHPA chip heat sink when placed horizontally has the best heat transfer performance.At a heating power of 160 W,the average thermal resistance of the heat sink is 89.6 K/(W·m^(2)),and the heat sink can stabilize the temperature of the chip at 57.9℃.The dual L-MHPA chip heat sink has better tilt angle adaptability.
作者
陈晔
王宏燕
赵耀华
田济邦
全贞花
Chen Ye;Wang Hongyan;Zhao Yaohua;Tian Jibang;Quan Zhenhua(Beijing Key Laboratory of Green Built Environment and Energy Efficient Technology,Beijing University of Technology,Beijing 100124,China;Zibo Boyi New Energy Technology Development,Zibo 255220,China)
出处
《低温与超导》
CAS
北大核心
2024年第1期27-35,共9页
Cryogenics and Superconductivity
基金
国家重点研发项目(2022YFE0118500)。
关键词
芯片
微热管阵列
传热性能
热阻
Chip
Micro heat pipe array
Heat transfer performance
Thermal resistance
作者简介
陈晔(1998-),男,硕士研究生,研究方向为芯片热管理;通信作者:王宏燕(1968-),女,副教授,研究方向为热管传热强化(wanghongyan@bjut.edu.cn)。
