摘要
随着电子产品的快速发展,散热问题已成为制约电子产品性能的重要因素。环氧树脂导热填料是一种常用的散热材料,但其表面粗糙度较大,导热性能不稳定,限制了其应用,故改善环氧树脂导热填料的表面性能成为研究热点。综述了环氧树脂导热填料表面改性方法的研究进展,介绍了金属类填料、无机陶瓷类填料及碳类填料在环氧树脂导热填料中的应用,包括导热机理、填料改性方法及国内外研究现状,对未来发展趋势进行了展望。
With the rapid development of electronic products,heat dissipation has become an important factor restricting the performance of electronic products.Epoxy resin thermal conductive filler is commonly used as heat dissipation material,but its application is limited by its high surface roughness and unstable thermal conductivity.Therefore,how to improve the surface performance of epoxy resin thermal conductive fillers is one of the current hot research directions.The study reviews the research progress of surface modification methods for epoxy resin thermal conductive fillers.The application of metal fillers,inorganic ceramic fillers,and carbon fillers in epoxy resin thermal conductive fillers is reviewed,including thermal conductivity mechanism,filler modification methods,and research status at home and abroad.Finally,the future development trend is prospected.
作者
崔向红
王瑞琨
刘晓东
陈明月
李天智
庄缅
Cui Xianghong;Wang Ruikun;Liu Xiaodong;Chen Mingyue;Li Tianzhi;Zhuang Mian(Institute for Advanced Technology of HAS,Harbin 150020,China;Heilongjiang Province Building Materials Industry Planning and Design Institute,Harbin 150000,China)
出处
《黑龙江科学》
2023年第14期80-82,85,共4页
Heilongjiang Science
基金
黑龙江省科学院科学研究基金项目(KY2023GJS02)
黑龙江省省属科研院所科研业务费项目(ZNBZ2023GJS03)。
关键词
环氧树脂
导热机理
导热填料
改性方法
Epoxy resin
Thermal conducting mechanism
Thermal conductive filler
Modification method
作者简介
崔向红(1979-),女,本科,高级工程师。研究方向:聚合物基复合材料。;通信作者:庄缅(1980-),男,学士。研究方向:灌封胶及职业卫生评价。E-mail:583141387@qq.com。
