摘要
研制了一款基于高温共烧陶瓷(HTCC)工艺的光调制器外壳,通过高速端口实现信号的传输。端口的设计采用共面波导结构的水平传输和类同轴结构的垂直传输,通过分析高速信号传输通道的等效电路和在频域上的仿真,实现端口的阻抗匹配,在保证信号完整性的前提下端口可以实现单通道28 Gbit/s的高速信号传输。将相同条件下的差分过孔结构与类同轴结构在频域和时域下展开分析,验证了类同轴结构可以更有效地保证信号完整性。利用探针测试与背靠背结构相结合的方式对样品进行测试,验证了高速端口可以在保证信号完整性的前提下实现单通道28 Gbit/s的高速信号传输速率。将该结构应用在8通道的光调制器外壳上,可以支持200 Gbit/s以上的高速信号传输。
An optical modulator package based on high-temperature co-fired ceramic(HTCC)process is researched for signal transmission through a high-speed port.The horizontal transmission of the coplanar waveguide structure and the vertical transmission of the coaxial-like structure are applied in the high-speed port.By analyzing its equivalent circuit of the high-speed signal transmission channel and simulating in frequency domain to realize the impedance matching of the port,the port can realize the high-speed signal transmission of 28 Gbit/s in a single-channel under the premise of ensuring the signal integrity.The differential vias structure and coaxial-like structure under the same conditions are analyzed in frequency domain and time domain.It is verified that the coaxial-like structure has better transmission characteristics and can more effectively ensure the signal integrity.The probe test is combined with the back-to-back structure to test the samples,and it is verified that the high-speed port can realize a high-speed signal transmission rate of 28 Gbit/s for a single channel under the premise of ensuring signal integrity.The structure is applied to the eight-channel package of optical module,which can support high-speed signal transmission above 200 Gbit/s.
作者
胡进
颜汇锃
陈寰贝
HU Jin;YAN Huizeng;CHEN Huanbei(Nanjing Electronic Devices Institute,Nanjing 210016,China)
出处
《电子与封装》
2023年第7期71-76,共6页
Electronics & Packaging
作者简介
胡进,E-mail:zhang_ki@163.com。
