摘要
为了在微电子器件内凸点下金属化层设计中广泛应用镍基镀层,需要具备良好的润湿性和结合强度。本研究采用电化学表面沉积技术,在金属铜基板上制备了具有不同表面形貌的镍基镀层,并建立了电流密度与镀层表面形貌、均匀性之间的关系。通过系统研究不同镍基镀层上锡基焊球的润湿角和焊点抗剪切强度,发现在电流密度为2.00 A/dm^(2)时制备的镀层表现出最佳表面性能,焊点抗剪切强度可达92.6 MPa。此时,镀层表面呈现金字塔状的镍颗粒,润湿角为75°。
Nickel-based coatings are extensively employed in the design of metallized layers for microelectronic devices,which require excellent wettability and bonding strength.In this study,nickel coatings with different surface morphologies were prepared on copper substrates using electroplating technology.The relationship between current density and surface morphology and uniformity of nickelbased coatings was established.Furthermore,the wetting angle and shear strength of solder joints on different nickel-based coatings were systematically investigated.The findings indicate that the coating prepared at a current density of 2.00 A/dm^(2)exhibits superior surface performance,with a maximum shear strength of 92.6 MPa and pyramid-shaped nickel particles on the coating surface.Additionally,the wetting angle of this coating is 75°.
作者
王明明
徐子轩
王守豪
郑浩
刘振宇
刘俐
Wang Mingming;Xu Zixuan;Wang Shouhao;Zheng Hao;Liu Zhenyu;Liu Li(Wuhan Representative Bureau of Naval Department of Equipment,Wuhan 430022,China;School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China;China Ship Development and Design Center,Wuhan 430064,China)
出处
《电镀与精饰》
CAS
北大核心
2023年第7期26-32,共7页
Plating & Finishing
基金
国家自然科学基金项目(编号:62004144,61904127)。
关键词
电化学沉积
表面形貌
润湿角
剪切强度
断面形貌
electrodeposition
surface morphology
wetting angle
shear strength
fracture morphology
作者简介
王明明(1980-),男,高级工程师,e-mail:306984241@qq.com;通信作者:刘俐,e-mail:l.liu@whut.edu.cn。
