摘要
为了减小电子适配器注塑成型过程中的翘曲变形量,通过Moldflow对其注塑成型过程进行仿真分析,采用最优拉丁超立方试验随机抽取样本,建立Kriging代理模型替代传统的模流仿真过程。通过多目标遗传算法对其成型工艺参数进行全局寻优,对制件模具温度、熔体温度、保压压力以及冷却时间进行多目标优化,以制件的翘曲变形量为响应目标。结果表明:代理模型R2为0.91129,表明模型效果较好,可以用预测值替代模拟值,多目标遗传算法优化后最佳的成型工艺参数模具温度为51℃,熔体温度为220℃,保压压力为101 MPa,冷却时间为15 s,此时制件的翘曲变形量最小为2.189 mm,与预测值的误差为1.08%,较未优化前降低1.221 mm,通过此方法有效改善制件的成型质量。
In order to reduce the warpage deformation in the injection molding process of the electronic adapter,the injection molding process was simulated and analyzed by Moldflow.The samples were randomly selected by the optimal Latin hypercube test,and the Kriging surrogate model was established to replace the traditional mold flow simulation process.The multi-objective genetic algorithm is used to globally optimize the molding process parameters,and the multi-objective optimization of the mold temperature,melt temperature,holding pressure and cooling time is carried out to target the warpage deformation of the part.The results show that the surrogate model R2 is 0.91129,indicating that the model effect is good,and the predicted value can be used to replace the simulated value.The optimal molding process parameters after multi-objective genetic algorithm optimization are mold temperature of 51℃,melt temperature of 220℃,holding pressure of 101 MPa,and cooling time of 15 s.At this time,the minimum warpage deformation of the part is 2.189 mm,and the error with the predicted value is 1.08%,which is 1.221 mm lower than that before optimization.This method effectively improves the molding quality of the part.
作者
王晓衬
WANG Xiao-chen(Zhengzhou College of Finance and Economics,Zhengzhou 450000,China)
出处
《塑料科技》
CAS
北大核心
2023年第5期90-94,共5页
Plastics Science and Technology
作者简介
联系人:王晓衬,wangxiaochen6789@sina.com。
