摘要
为解决高热流密度、大功耗电子器件散热问题,设计了一种串、并联结合的微小流道集成模块冷板进行局部强化传热。结合热源温度、流体压降、均温性等因素,基于流体传热仿真的评估方法对冷板进行换热性能分析和优化。在微小通道区域,研究对比矩形长直型、圆形扰流柱、菱形扰流柱3种不同流道结构形式对冷板传热性能及流动特性的影响。研究结果表明:使用菱形扰流柱形式的微流道与矩形长直流道相比,最高温度降低23.8℃,均温性减小7.7℃,能满足冷板表面最高温度≤65℃的要求。菱形扰流柱可以大幅强化换热效果,散热效果提高了27%左右,取得了较好的工作温度和均温性。
In order to solve the heat dissipation problem of electronic devices with high heat flux density and high power consumption,a micro-channel integrated module cold plate with series/parallel combination is designed to enhance local heat transfer.Combined with heat source temperature,fluid pressure drop,temperature uniformity and other factors,the heat transfer performance of cold plate is analyzed and optimized based on the evaluation method of fluid heat transfer simulation.In the micro-channel area,the influence of three different flow channel structure forms,namely rectangular long straight,circular spoiler and diamond spoiler on heat transfer performance and flow characteristics of cold plate is studied and compared.The study results show that the maximum temperature and the uniform temperature can be reduced by 23.8℃and 7.7℃respectively by using the micro-channel of diamond spoiler compared to using the micro-channel of rectangular long straight,which can meet the requirement that the maximum surface temperature of the cold plate is less than 65℃.The diamond spoiler can greatly strengthen the heat transfer effect,so the heat dissipation effect is increased by about 27%,and better working temperature and temperature uniformity are obtained.
作者
张星
ZHANG Xing(Nanjing Corad Electronic Equipment Co.Ltd,Nanjing 211100,China)
出处
《舰船电子对抗》
2023年第3期108-112,共5页
Shipboard Electronic Countermeasure
关键词
高热流密度
微小流道
扰流柱
换热性能
high heat flux density
micro-channel
spoiler column
heat transfer performance
