摘要
为研究印制电路板机械通孔的电镀填孔工艺与效果,选定板厚0.3 mm与0.4 mm、孔径0.15 mm的测试板作为研究对象,在沉铜闪镀线进行不同参数的搭桥测试。研究表明:在正反比1∶6~1∶8,时间比80∶4~80∶6的波形条件下,适当降低电流密度并提高喷流强度,有利于提高通孔孔内的搭桥质量。搭桥后的板件分别采用水平线和垂直连续电镀线(VCP)进行搭桥后的填孔测试,得到良好的填孔效果,说明所采用的工艺可为后续机械通孔填孔制作提供参考和借鉴。
This paper introduces the main influence factors of flling process on the through-hole plating.The research test board was 0.3mm&0.4mm thickness of 0.15 mm diameter panel,and the bridge-plating test with different parameters was optimized through the horizontal flash plating line.It is beneficial to improve the quality of the bridgeplating by decreasing the current density and increasing the current density with positive/negative ratio of 1:6~1:8 and time ratio of 80:4~80:6.The experiment results show excellent flling ability of filling process on the horizontal plating line and vertical continuous electroplating line.It provides reference for the subsequent manufacture of through-hole plating technology.
作者
程骄
周小平
林以炳
王俊
付凤奇
CHENG Jiao;ZHOU Xiaoping;LIN Yibing;WANG Jun;FU Fengqi(Zhuhai Kinwong Electronic Co.,Ltd.,Zhuhai 519090,Guangdong,China)
出处
《印制电路信息》
2023年第3期30-35,共6页
Printed Circuit Information
关键词
机械通孔
搭桥
水平电镀线
垂直连续电镀线
filling through hole
bridge-plating
horizontal plating
vertical continuous electroplating line
作者简介
程骄(1984-),男,高级工程师,硕士,主要研究方向为PCB湿制程的新产品工艺开发等。
