摘要
利用光学显微镜、X射线衍射(XRD)、电子背散射衍射(EBSD)技术、万能试验机等分析了轧制和热处理工艺对Cu-Sn-P合金带材晶粒尺寸、晶粒取向、组织分布和性能的影响,并建立了形变热处理工艺-带材微观组织-带材折弯性能之间的联系。结果表明:Cu-Sn-P合金带材先经过70%变形量的冷轧加工,再在650℃下进行走带速度为65 m·min^(-1)连续退火处理后,可将带材的变形加工组织与再结晶组织比例控制在5:1左右,带材的晶粒平均直径为3.5μm,且晶粒大小均匀。随后经15%冷轧变形和230℃保温3 h的低温去应力退火处理后,合金带材抗拉强度达到716 MPa,在垂直于带材轧制方向和平行于轧制方向分别进行180°折弯测试,带材表面在相对弯曲半径R/t≤1.5时均不开裂且无明显大褶皱。
Effect of rolling and heat treatment processes on grain size,grain orientation,microstructure distribution and properties of Cu-Sn-P alloy strip was analyzed by means of optical microscope,X-ray diffraction(XRD),electron backscatter diffraction(EBSD)technology and universal testing machine,and the relationship among thermomechanical treatment process,strip microstructure and strip bending properties was established.The results show that when the Cu-Sn-P alloy strip is first cold rolled with 70%deformation and then continuous annealing at 650℃ with a belt speed of 65 m·min^(-1),the ratio of deformed microstructure to recrystallized microstructure of the strip can be controlled at about 5∶1,the average grain diameter of the strip is 3.5μm,and the grain size is uniform.After 15% cold rolling deformation and low-temperature stress relief annealing at 230℃ for 3 h,the tensile strength of the alloy strip reaches 716 MPa.The results of 180°bending tests which were carried out perpendicular to and parallel to the rolling direction of the strip show that when the relative bending radius R/t≤1.5,the surface of the strip does not crack and has no obvious large folds.
作者
罗金宝
巢国辉
项燕龙
华称文
傅杰
裘桂群
李周
LUO Jin-bao;CHAO Guo-hui;XIANG Yan-long;HUA Cheng-wen;FU Jie;QIU Gui-qun;LI Zhou(Ningbo Jintian Copper(Group)Co Ltd,Ningbo 315000,China;School of Materials Science and Engineering,Central South University,Changsha 410083,China)
出处
《材料热处理学报》
CAS
CSCD
北大核心
2023年第2期46-52,共7页
Transactions of Materials and Heat Treatment
基金
宁波市重大科技任务攻关项目(2021Z032)。
关键词
Cu-Sn-P合金
形变热处理
连续退火
晶粒取向
折弯性能
Cu-Sn-P alloy
thermomechanical treatment
continuous annealing
grain orientation
bending performance
作者简介
罗金宝(1990-),男,博士,主要从事铜及铜合金研究,E-mail:ljb386628134@163.com;通信作者:巢国辉(1980-),男,高级工程师,硕士,主要从事铜及铜合金研究,电话:0574—87498750,E-mail:jt630407022@163.com。
