摘要
导电胶在电子封装领域虽受到广泛关注,但由于导电胶性能的一些限制,仍不能完全用导电胶代替焊料。这主要与导电胶的可靠性有关,例如不稳定的接触电阻、有限的抗冲击性、低附着力和导电性。本文介绍了导电胶的分类、各类导电填料以及导电胶可靠性的研究现状,旨在阐述导电胶的综合性能,展望未来导电胶的发展趋势。
Although conductive adhesive has received extensive attention in the field of electronic packaging,it can not completely replace solder with conductive adhesive because of some limitations of its performance.This is mainly related to the reliability of conductive adhesive,such as unstable contact resistance,limited impact resistance,low adhesion and electrical conductivity.In this paper,the classification of conductive adhesive,various conductive fillers and the research status of the reliability of conductive adhesive were introduced,aiming at revealing the comprehensive performance of conductive adhesive and prospecting the future development trend of conductive adhesive.
作者
张微微
刘昊
刘加豪
李明雨
陈宏涛
Zhang Weiwei;Liu Hao;Liu Jiahao;Li Mingyu;Chen Hongtao(Harbin Institute of Technology(Shenzhen)School of Materials Science and Engineering,Shenzhen 518055,Guangdong,China;The Fifth Electronics Research Institute of Ministry of Industry and Information Technology,Guangzhou 511370,Guangdong,China)
出处
《中国胶粘剂》
CAS
2022年第10期51-56,共6页
China Adhesives
基金
广东省自然科学基金项目(2019A1515011844)。
关键词
导电胶
导电填料
可靠性
电子封装
conductive adhesive
conductive filler
reliability
electronic packaging
作者简介
张微微(1993-),女,重庆人,博士,主要从事导电胶粘剂方面的研究。E-mail:1185690051@qq.com;通信作者:陈宏涛。E-mail:chenht@hit.edu.cn。
